IP Library Granted Patent US 11,088,482
Granted Patent B2
US 11,088,482 · App. 16/695,868 · Granted Aug 10, 2021

Metallic material and connection terminal

Inventors: Akihiro Kato (Yokkaichi, JP); Yoshifumi Saka (Yokkaichi, JP); Ryota Mizutani (Yokkaichi, JP)
Assignees: AUTONETWORKS TECHNOLOGIES, LTD.; SUMITOMO WIRING SYSTEMS, LTD.; SUMITOMO ELECTRIC INDUSTRIES, LTD.
H01R13/03B32B15/01B32B15/018B32B15/04B32B15/043B32B15/20C22C5/06C22C27/00C23C28/02C23C28/021C23C28/023C23C30/00C23C30/005H01B1/026B32B2457/00Y10T428/1291Y10T428/12681Y10T428/12847Y10T428/12854Y10T428/12875Y10T428/12882Y10T428/12896Y10T428/12903Y10T428/12917Y10T428/12931Y10T428/12937Y10T428/12944Y10T428/12951Y10T428/12993
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Quick Facts
Patent No.
US 11,088,482
App. No.
16/695,868
Granted
Aug 10, 2021
Kind
B2
Abstract

A metallic material that includes a base material; and a surface layer formed on a surface of the base material and exposed on an outermost surface, wherein the surface layer contains Ag, and In less than the Ag in atomic ratio, and a connection terminal being made of the metallic material, wherein the surface layer is formed on a surface of the base material, at least in a contact portion electrically contacting an opposite electrically conductive member.

Claims (13)

1. A metallic material comprising:

a base material; and

a surface layer formed on a surface of the base material and exposed on an outermost surface, wherein

the surface layer contains both Ag and In, wherein In is present less than the Ag in atomic ratio, and wherein

the surface layer includes an Ag portion containing Ag as a main constituent and optionally In, and a high-concentration In portion containing a higher-concentration of In than in the Ag portion, and the Ag portion and the high-concentration In portion are both exposed on the outermost surface.

2. The metallic material according to claim 1 , wherein at least part of the In contained in the surface layer is an Ag—In alloy.

3. The metallic material according to claim 1 , wherein the Ag portion is made of soft silver.

4. The metallic material according to claim 1 , wherein (In/Ag) is 0.05 or more.

5. The metallic material according to claim 1 , wherein (In/Ag) is 0.25 or less.

6. The metallic material according to claim 1 , wherein a total amount of the In contained in the surface layer detected by an X-ray diffraction method is an Ag—In alloy.

7. The metallic material according to claim 1 , wherein the base material is made of Cu or a Cu alloy, and

includes, between the base material and the surface layer, an intermediate layer containing at least one kind selected from the group consisting of Ni, Cr, Mn, Fe, Co, and Cu.

8. A connection terminal being made of the metallic material according to claim 1 , wherein the surface layer is formed on a surface of the base material, at least in a contact portion electrically contacting an opposite electrically conductive member.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 26, 2019
From: KATO, AKIHIRO; SAKA, YOSHIFUMI; MIZUTANI, RYOTA
To: AUTONETWORKS TECHNOLOGIES, LTD.; SUMITOMO WIRING SYSTEMS, LTD.; SUMITOMO ELECTRIC INDUSTRIES, LTD.
Reel/Frame 051118/0969 →
Priority Claims (1)
JP JP2019-007133 · Jan 18, 2019 · national
Continuity (1)
Related Publication 20200235511A1 · Jul 23, 2020