IP Library › Granted Patent US 11,089,683
Granted Patent B2
US 11,089,683 · App. 16/944,717 · Granted Aug 10, 2021

Optical module

Inventors: Daisuke Noguchi (Tachikawa, JP); Hiroshi Yamamoto (Inagi, JP)
Assignee: CIG PHOTONICS JAPAN LIMITED
H05K1/118H05K1/028H05K1/189H01R12/62H01R12/63H01R12/67H04B10/50H04B10/60H05K2201/055H05K2201/093H05K2201/09063H05K2201/09227H05K2201/09445H05K2201/10121H05K2201/10356
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Quick Facts
Patent No.
US 11,089,683
App. No.
16/944,717
Granted
Aug 10, 2021
Kind
B2
Abstract

An insulation film has a first surface and a second surface opposite to each other and has a first portion and a second portion extending in a direction opposite to each other from a central portion. The optical subassembly is connected to the flexible printed circuit board at the central portion with the stem opposed to the second surface. The flexible printed circuit board curves with the second surface at least the central portion facing outward. The printed circuit board intervenes between edges of the first portion and the second portion and is connected to the flexible printed circuit board. The first portion and the second portion of the flexible printed circuit board curves in a shape to avoid mutual contact and three-dimensionally intersect with each other, and the first portion and the second portion on the second surface are opposed to the printed circuit board.

Claims (29)

1. An optical module comprising:

an optical subassembly for converting an optical signal and an electric signal at least from one to another, the optical subassembly having a stem;

a flexible printed circuit board having an insulation film with a first surface and a second surface opposite to each other and with a first portion and a second portion extending in a direction opposite to each other from a central portion, the flexible printed circuit board having a first ground plain on the second surface; and

a printed circuit board having an insulation layer with a third surface and a fourth surface opposite to each other, the printed circuit board having a second ground plain,

wherein

the optical subassembly is connected to the flexible printed circuit board with the stem opposed to the second surface at the central portion,

the flexible printed circuit board curves with the second surface facing outward at least at the central portion,

the printed circuit board intervenes between edges of the first portion and the second portion and is connected to the flexible printed circuit board, and

the first portion and the second portion of the flexible printed circuit board curves in a shape to avoid mutual contact and three-dimensionally intersect with each other, and the first portion and the second portion on the second surface are opposed to the printed circuit board.

2. The optical module according to claim 1 , wherein

the flexible printed circuit board on the second surface has a first ground terminal connected to the first ground plain,

the printed circuit board on the third surface has a second ground terminal connected to the second ground plain,

the first ground terminal and the second ground terminal are connected to each other.

3. The optical module according to claim 1 , wherein

the flexible printed circuit board at the central portion and the first portion on the first surface has a first interconnect pattern, the flexible printed circuit board at the first portion on the second surface having a first terminal connected to the first interconnect pattern,

the printed circuit board has a third interconnect pattern, the printed circuit board on the third surface having a third terminal connected to the third interconnect pattern, and

the first terminal and the third terminal are connected to each other.

4. The optical module according to claim 3 , wherein

the first ground plain is at the central portion and at the first portion and overlaps with the first interconnect pattern, and

the first interconnect pattern includes a high-frequency signal line.

5. The optical module according to claim 3 , wherein

the flexible printed circuit board at the central portion and the second portion on the first surface has a second interconnect pattern, the flexible printed circuit board at the second portion on the second surface having a second terminal connected to the second interconnect pattern,

the printed circuit board has a fourth interconnect pattern, the printed circuit board on the fourth surface having a fourth terminal connected to the fourth interconnect pattern, and

the second terminal and the fourth terminal are connected to each other.

6. The optical module according to claim 5 , wherein the second interconnect pattern includes a direct-current signal line.

7. The optical module according to claim 1 , wherein one of the first portion and the second portion of the insulation film has an opening or a cutout.

8. The optical module according to claim 7 , wherein

the second portion has the opening or the cutout, and

the first portion is situated inside the opening or the cutout.

Assignments (2)
CHANGE OF ADDRESS Recorded Jul 19, 2024
From: CIG PHOTONICS JAPAN LIMITED
To: CIG PHOTONICS JAPAN LIMITED
Reel/Frame 068436/0287 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 31, 2020
From: NOGUCHI, DAISUKE; YAMAMOTO, HIROSHI
To: CIG PHOTONICS JAPAN LIMITED
Reel/Frame 053369/0414 →
Priority Claims (1)
JP JP2019-151107 · Aug 21, 2019 · national
Continuity (1)
Related Publication 20210059050A1 · Feb 25, 2021
Cited By (1)
US 12,413,041