Antimicrobial shape memory polymers
An embodiment includes a system comprising a thermoset polyurethane shape memory polymer (SMP) foam that includes at least one antimicrobial agent. The antimicrobial agent may include at least one phenolic acid that is a pendent group chemically bonded to a polyurethane polymer chain of the SMP foam. Other embodiments are described herein.
1. A system comprising:
a thermoset polyurethane shape memory polymer (SMP) foam that includes at least one antimicrobial agent;
wherein the at least one antimicrobial agent includes a phenolic acid, and the SMP foam has a dry glass transition temperature (T g ) above 40 degrees C. and a wet T g below 34 degrees C.;
wherein the SMP foam includes a reaction product of hexamethylene diisocyanate (HDI) with one or more of trimethanolamine (TEA), N,N,N′,N′ tetrakis (hydroxyl propylene) ethylenediamine (HPED), or combinations thereof;
wherein the phenolic acid is a pendant group chemically bonded, via an ester, to a polyurethane polymer chain of the SMP foam; and
wherein the phenolic acid includes one or more of benzoic acid, gentisic acid, 4-hydroxy benzoic acid, p-coumaric acid, vanillic acid, syringic acid, protocatechuic acid, gallic acid, ferulic acid, sinapic acid, caffeic acid, or combinations thereof.
2. The system of claim 1 wherein the SMP foam is physically cross-linked around the at least one antimicrobial agent.
3. The system of claim 1 comprising:
a thermoset polyurethane second SMP foam that includes a phenolic acid that is a pendent group chemically bonded to a polyurethane polymer chain of the second SMP foam; and
a thermoset polyurethane third SMP foam that includes a phenolic acid that is a pendent group chemically bonded to a polyurethane polymer chain of the third SMP foam;
wherein (a) the SMP foam comprises a first foam, and (b) the first, second, and third SMP foams are all enclosed in a sealed kit.
4. The system of claim 1 , wherein the wet T g is below 30 degrees C.