IP Library › Granted Patent US 11,091,836
Granted Patent B2
US 11,091,836 · App. 16/131,458 · Granted Aug 17, 2021

Graphene structure forming method and graphene structure forming apparatus

Inventors: Ryota Ifuku (Nirasaki, JP); Takashi Matsumoto (Nirasaki, JP)
Assignee: TOKYO ELECTRONICS LIMITED
C23C16/511C23C16/26C23C16/452C23C16/45561C23C16/45565C23C16/52H01J37/3222H01J37/3244H01J37/32311H01J37/32724H01L21/0259H01L21/0262H01L21/02381H01L21/02425H01L21/02488H01L21/02491H01L21/02527H01J2237/3321Y10S977/844
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,091,836
App. No.
16/131,458
Granted
Aug 17, 2021
Kind
B2
Abstract

A graphene structure forming method for forming a graphene structure is provided. The method comprises preparing a target substrate, and forming the graphene structure on a surface of the target substrate by remote microwave plasma CVD using a carbon-containing gas as a film-forming raw material gas in a state in which the surface of the target substrate has no catalytic function.

Claims (46)

1. A graphene structure forming method comprising:

preparing a target substrate; and

forming a graphene structure on a surface of the target substrate by remote microwave plasma chemical vapor deposition (CVD) using a carbon-containing gas as a film-forming raw material gas in a state in which the surface of the target substrate has no catalytic function,

wherein the forming the graphene structure includes:

disposing the target substrate in a region spaced apart from a plasma generation region where the remote microwave plasma is generated;

generating the remote microwave plasma in the plasma generation region;

supplying the carbon-containing gas to a predetermined position between the plasma generation region and the target substrate such that the carbon-containing gas is dissociated by the remote microwave plasma; and

supplying the dissociated carbon-containing gas to the target substrate,

wherein the forming the graphene structure is performed by a processing apparatus, the processing apparatus including:

a processing container configured to accommodate the target substrate;

a mounting table configured to horizontally mount the target substrate inside the processing container;

a heating mechanism configured to heat the target substrate;

a microwave introduction device provided on the processing container;

a gas supply mechanism configured to supply a gas including the carbon-containing gas as the film-forming raw material gas into the processing container; and

an exhaust mechanism configured to exhaust an interior of the processing container,

wherein the microwave introduction device includes a microwave generator configured to generate microwaves, and a plurality of microwave radiation mechanisms supplied with the microwaves distributed from the microwave generator and configured to radiate the microwaves into the processing container,

wherein each of the microwave radiation mechanisms includes a tuner configured to perform impedance matching, a planar slot antenna having slots configured to radiate the microwaves, and a microwave transmitting plate that is provided just below the planar slot antenna, fitted to a ceiling wall of the processing container and made of a dielectric material,

wherein the gas supply mechanism supplies a rare gas as a plasma generation gas to the plasma generation region just below the ceiling wall of the processing container, and supplies the carbon-containing gas as the film-forming raw material gas from nozzles, which are fit into openings formed in the ceiling wall and extend downward from the ceiling wall, to the predetermined position between the ceiling wall and the target substrate on the mounting table,

wherein the carbon-containing gas is a gas selected from a group consisting of ethylene (C 2 H 4 ), methane (CH 4 ), ethane (C 2 H 6 ), propane (C 3 H 8 ), propylene (C 3 H 6 ), acetylene (C 2 H 2 ), methanol (CH 3 OH), and ethanol (C 2 H 5 OH), and

wherein the forming the graphene structure is performed under a pressure in a range of 100 mTorr to 5 Torr such that no carbon nanowall grows.

2. The method of claim 1 , wherein the surface of the target substrate is an insulator or a semiconductor.

3. The method of claim 1 , wherein the surface of the target substrate is a metal.

4. The method of claim 1 , wherein the forming the graphene structure is performed under a temperature of the target substrate in a range of 350 to 1000 degrees C., a microwave power in a range of 100 to 5000 W and a time in a range of 1 to 200 min.

5. The method of claim 1 , wherein the graphene structure is composed of only graphene formed parallel to the target substrate.

6. A graphene structure forming method comprising:

preparing a target substrate; and

forming a graphene structure on a surface of the target substrate by remote microwave plasma chemical vapor deposition (CVD) using a carbon-containing gas as a film-forming raw material gas,

wherein the forming the graphene structure includes:

disposing the target substrate in a region spaced apart from a plasma generation region where the remote microwave plasma is generated;

generating the remote microwave plasma in the plasma generation region;

supplying the carbon-containing gas to a predetermined position between the plasma generation region and the target substrate such that the carbon-containing gas is dissociated by the remote microwave plasma; and

supplying the dissociated carbon-containing gas to the target substrate,

wherein the forming the graphene structure is performed by a processing apparatus, the processing apparatus including:

a processing container configured to accommodate the target substrate;

a mounting table configured to horizontally mount the target substrate inside the processing container;

a heating mechanism configured to heat the target substrate;

a microwave introduction device provided on the processing container;

a gas supply mechanism configured to supply a gas including the carbon-containing gas as the film-forming raw material gas into the processing container; and

an exhaust mechanism configured to exhaust an interior of the processing container,

wherein the microwave introduction device includes a microwave generator configured to generate microwaves, and a plurality of microwave radiation mechanisms supplied with the microwaves distributed from the microwave generator and configured to radiate the microwaves into the processing container,

wherein each of the microwave radiation mechanisms includes a tuner configured to perform impedance matching, a planar slot antenna having slots configured to radiate the microwaves, and a microwave transmitting plate that is provided just below the planar slot antenna, fitted to a ceiling wall of the processing container and made of a dielectric material,

wherein the gas supply mechanism supplies a rare gas as a plasma generation gas to the plasma generation region just below the ceiling wall of the processing container, and supplies the carbon-containing gas as the film-forming raw material gas from nozzles, which are fit into openings formed in the ceiling wall and extend downward from the ceiling wall, to the predetermined position between the ceiling wall and the target substrate on the mounting table,

wherein the carbon-containing gas is a gas selected from a group consisting of ethylene (C 2 H 4 ), methane (CH 4 ), ethane (C 2 H 6 ), propane (C 3 H 8 ), propylene (C 3 H 6 ), acetylene (C 2 H 2 ), methanol (CH 3 OH), and ethanol (C 2 H 5 OH)), and

wherein the forming the graphene structure is performed under a pressure in a range of 100 mTorr to 5 Torr such that no carbon nanowall grows.

7. The method of claim 6 , wherein the surface of the target substrate is an insulator, a semiconductor or a metal.

8. The method of claim 6 , wherein the forming the graphene structure is performed under a temperature of the target substrate in a range of 350 to 1000 degrees C., a microwave power in a range of 100 to 5000 W and a time in a range of 1 to 200 min.

Assignments (2)
CORRECTIVE ASSIGNMENT TO CORRECT THE COUNTRY OF THE ASSIGNEE PREVIOUSLY RECORDED ON REEL 046887 FRAME 0497. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT OF ASSIGNOR'S INTEREST. Recorded Oct 24, 2018
From: IFUKU, RYOTA; MATSUMOTO, TAKASHI
To: TOKYO ELECTRON LIMITED
Reel/Frame 047304/0158 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 17, 2018
From: IFUKU, RYOTA; MATSUMOTO, TAKASHI
To: TOKYO ELECTRON LIMITED
Reel/Frame 046887/0497 →
Priority Claims (1)
JP JP2017-180049 · Sep 20, 2017 · national
Continuity (1)
Related Publication 20190085457A1 · Mar 21, 2019