Sensor package and a method of manufacturing a sensor package
A sensor package 1 includes a sensor carrier 2 with a sensor element 4 , a pre-moulded tray part 10 with an exposed cavity 12 , the sensor carrier 2 with the sensor element 4 being positioned in a recess 21 of the pre-moulded tray part 10 part to extend into the exposed cavity 12 . A lead frame 6 is arranged to provide external connections of the sensor package 1 , an over-moulding package part 8 , arranged around the lead frame 6 and the pre-moulded tray part 10 and having an aperture 12 a aligned with the exposed cavity 12.
1. A sensor package comprising:
a sensor carrier with a sensor element,
a pre-moulded tray part with an exposed cavity, the sensor carrier with the sensor element being positioned in a recess of the pre-moulded tray part to extend into the exposed cavity,
a lead frame arranged to provide external connections of the sensor package,
an over-moulding package part, arranged around the lead frame and the pre-moulded tray part and having an aperture aligned with the exposed cavity,
wherein the recess of the pre-moulded tray part comprises at least one barrier arranged to extend inward into the recess.
2. The sensor package according to claim 1 , wherein the at least one barrier has an extension height (h) of at least 1 μm.
3. The sensor package according to claim 1 , wherein the recess of the pre-moulded tray part comprises one or more spacers.
4. The sensor package according to claim 1 , wherein the recess of the pre-moulded tray part further comprises an expansion space, arranged proximal to the exposed cavity with respect to the at least one barrier.
5. The sensor package according to claim 1 , wherein the sensor carrier is provided with an indentation at a side wall of the sensor carrier.
6. The sensor package according to claim 1 , wherein the recess and the sensor carrier comprise congruent sloping walls.
7. The sensor package according to claim 1 , wherein the aperture has a cross sectional area larger than a cross sectional area of the exposed cavity.
8. The sensor package according to claim 1 , further comprising a sensor support element positioned on a bottom of the exposed cavity of the pre-moulded tray part.
9. The sensor package according to claim 1 , further comprising an integrated circuit positioned on the lead frame, and electrical connections between the integrated circuit and the sensor carrier, wherein the integrated circuit and electrical connections are covered by the over-moulding package part.
10. The sensor package according to claim 1 , wherein a moulding compound of the pre-moulded tray part comprises a filler material having smaller dimensions than a filler material of a moulding compound of the over-moulding package part.
11. A method of manufacturing a sensor package, the method comprising providing a lead frame;
forming a pre-moulded tray part with an exposed cavity and a recess, wherein the recess of the pre-moulded tray part comprises at least one barrier arranged to extend inward into the recess;
positioning a sensor carrier with a sensor element in the recess of the pre-moulded tray part to extend into the exposed cavity,
forming an over-moulding package part by applying over moulding material around the lead frame and the pre-moulded tray part, and providing an aperture aligned with the exposed cavity.
12. The method according to claim 11 , wherein the pre-moulded tray part is formed using a first moulding compound, and the over-moulding package part is formed using a second moulding compound.
13. The method of claim 12 , wherein the second moulding compound comprises filler material having larger dimensions than filler material of the first moulding compound.