Conduction inspection device member and conduction inspection device
Provided is a conduction inspection device member, wherein cracks and voids are less likely to form in conductive parts, conduction performance is less likely to be impaired even when a conduction test is repeated, and contact marks are less likely to remain in the portion of the member in contact with a member to be tested. Also provided is a conduction inspection device comprising the conduction inspection device member. The conduction inspection device member comprises a substrate 13 , through holes 11 , and conductive parts 12 . The multiple through holes 11 are arranged in the substrate 13 , the conductive parts 12 are housed inside the through holes 11 , and the conductive parts 12 contain conductive particles 2 . The conductive particles 2 each comprise a substrate particle 21 and a conductive layer 22 on the surface of the substrate particle 21 . The conductive layer 22 has multiple protrusions 23 on the outer surface thereof.
1. A conduction inspection device member comprising a substrate, through holes, and conductive parts;
the through holes being arranged in the substrate,
the conductive parts being housed inside the through holes,
the conductive parts containing conductive particles and a binder, wherein the binder comprises a thermosetting resin and a heat-curing agent,
the conductive particles each comprising a substrate particle and a conductive layer on a surface of the substrate particle,
the conductive layer having multiple protrusions on an outer surface thereof.
2. The conduction inspection device member according to claim 1 , wherein the conductive particles contained in the conductive parts further comprise conductive particles having no multiple protrusions on the outer surface of the conductive layer.
3. The conduction inspection device member according to claim 2 , wherein the conductive layer comprises at least one member selected from the group consisting of copper, nickel, palladium, ruthenium, rhodium, silver, gold, platinum, iridium, cobalt, iron, tungsten, molybdenum, tin, germanium, indium, tellurium, thallium, bismuth, arsenic, selenium, phosphorus, boron, graphite, alumina, titanium oxide, tungsten carbide, and silicon carbide.
4. A conduction inspection device comprising the conduction inspection device member according to claim 3 .
5. A conduction inspection device comprising the conduction inspection device member according to claim 2 .
6. The conduction inspection device member according to claim 1 , wherein the conductive layer comprises at least one member selected from the group consisting of copper, nickel, palladium, ruthenium, rhodium, silver, gold, platinum, iridium, cobalt, iron, tungsten, molybdenum, tin, germanium, indium, tellurium, thallium, bismuth, arsenic, selenium, phosphorus, boron, graphite, alumina, titanium oxide, tungsten carbide, and silicon carbide.
7. A conduction inspection device comprising the conduction inspection device member according to claim 6 .
8. A conduction inspection device comprising the conduction inspection device member according to claim 1 .
9. The conduction inspection device member according to claim 1 , wherein the binder comprises at least one selected from the group consisting of silicone-based copolymers, vinyl resins, thermoplastic resins, curable resins, thermoplastic block copolymers, and elastomers.
10. The conduction inspection device member according to claim 1 , wherein the binder comprises solids in an amount of 5 to 99 parts by weight based on 100 parts by weight of the conductive particles.