Display apparatus having touch function and signal line method of mounting signal line of display apparatus
The present invention relates to a design for optimally mounting a Touch Drive (IC) (TDI) signal line and a Display Drive IC (DDI) signal line of a display apparatus having a touch function. According to the display apparatus having a touch function and the method of mounting the signal line of the display apparatus according to the present invention, the TDI signal line and the DDI signal line are mounted so as not to overlap in the bending region on the same flexible substrate, thereby preventing the problem, such as cracks, in the related art. Further, according to the display apparatus having a touch function and the method of mounting the signal line of the display apparatus according to the present invention, it is possible to easily manufacture a full-screen display apparatus by reducing a length of a fan-out area of the TDI signal line.
1. A display apparatus having a touch function, comprising:
a first flexible substrate including a plurality of first Touch Drive IC (TDI) signal lines and a plurality of Display Drive IC (DDI) signal lines in a first bending region, the DDI signal lines being extended to first non-bending regions except for the first bending region; and
a second flexible substrate located above the first flexible substrate and including a plurality of second TDI signal lines and a plurality of holes in second non-bending regions except for a second bending region of the second flexible substrate,
wherein the first flexible substrate and the second flexible substrate overlap each other, the first bending region and the second bending region are in an overlapping state, and the first non-bending regions and the second non-bending regions are in an overlapping state.
2. The display apparatus of claim 1 , further comprising:
an insulation substrate between the first flexible substrate and the second flexible substrate.
3. The display apparatus of claim 1 , wherein the plurality of second TDI signal lines formed in the second non-bending regions of the second flexible substrate is in contact with the plurality of first TDI signal lines formed in the first bending region of the first flexible substrate through the holes, respectively.
4. The display apparatus of claim 1 , wherein the first TDI signal lines and the DDI signal lines formed in the first bending region of the first flexible substrate do not overlap each other.
5. The display apparatus of claim 4 , wherein the first TDI signal lines formed in the first bending region of the first flexible substrate are disposed between the DDI signal lines at a predetermined interval.
6. The display apparatus of claim 1 , further comprising:
a plurality of multiplexers which is connected to the plurality of second TDI signal lines formed in the second flexible substrate to multiplex and output a touch signal.
7. The display apparatus of claim 1 , wherein a DDI connected to the DDI signal line and a TDI connected to the TDI signal line are mounted to a flexible PCB in a form of a Chip On Film (COF).
8. A method of mounting a signal line in a display apparatus having a touch function, the method comprising:
forming a plurality of first TDI signal lines and a plurality of DDI signal lines in a first bending region of a first flexible substrate, and extending and forming the DDI signal lines in first non-bending regions, except for the first bending region of the first flexible substrate; and
forming a plurality of second TDI signal lines and a plurality of holes in second non-bending regions, except for a second bending region of a second flexible substrate located above the first flexible substrate,
wherein the first flexible substrate and the second flexible substrate overlap each other, the first bending region and the second bending region are in an overlapping state, and the first non-bending regions and the second non-bending regions are in an overlapping state.
9. The method of claim 8 , further comprising:
disposing an insulation substrate between the first flexible substrate and the second flexible substrate.
10. The method of claim 8 , wherein the plurality of second TDI signal lines formed in the second non-bending regions of the second flexible substrate is in contact with the plurality of first TDI signal lines formed in the first bending region of the first flexible substrate through the holes, respectively.
11. The method of claim 8 , wherein the first TDI signal lines and the DDI signal lines formed in the first bending region of the first flexible substrate do not overlap each other.
12. The method of claim 11 , wherein the first TDI signal lines formed in the first bending region of the first flexible substrate are disposed between the DDI signal lines at a predetermined interval.
13. The method of claim 8 , further comprising:
multiplexing and outputting a touch signal transmitted to the plurality of second TDI signal lines through a plurality of multiplexers formed in the second flexible substrate.
14. The method of claim 8 , further comprising:
mounting a DDI connected to the DDI signal line and a TDI connected to the TDI signal line to a flexible PCB in a form of a COF.