Minimizing ringing in wide band gap semiconductor devices

1. A power conversion circuit, comprising:

a controller;

a power loop;

a first power amplifier and a second power amplifier, wherein both the first power amplifier and the second power amplifier are electrically coupled to the controller;

a gate control loop comprising:

a first semiconductor switch with a first gate electrically coupled to the first power amplifier; and

a second semiconductor switch with a first gate electrically coupled to the second power amplifier,

wherein the controller is configured to drive the first power amplifier to create a period of operational overlap for the first and second semiconductor switches by setting a gate voltage of the first semiconductor switch to an intermediate value above a threshold voltage of the first semiconductor switch,

wherein a magnetic coupling is formed between a parasitic inductance in the power loop and a parasitic inductance in the gate control loop, and

wherein the second semiconductor switch is turned on by the magnetic coupling.

2. The power conversion circuit of claim 1 , wherein to create the period of operational overlap, the controller is configured to:

at a first time, set the gate voltage of the first semiconductor switch to the intermediate value; and

at a second time, set the gate voltage of the first semiconductor switch to a low value.

3. The power conversion circuit of claim 2 , wherein the second semiconductor switch is turned on by the magnetic coupling at a third time between the first time and the second time.

4. The power conversion circuit of claim 3 , wherein a duration between the third time and the second time is selected to avoid damage caused by a short-circuit during the period of operation overlap.

5. The power conversion circuit of claim 1 , wherein the threshold voltage is a minimum amount of charge define by operational characteristics of the first semiconductor switch that is required at the gate to provide a conductive path between a drain and a source of the first semiconductor switch.

6. The power conversion circuit of claim 1 , wherein during the period of operational overlap, a short-circuit occurs between a drain of the first semiconductor switch and ground of the power conversion circuit connected to a source of the second semiconductor switch.

7. The power conversion circuit of claim 6 , wherein the intermediate value is set to control a surge current during the short-circuit.

8. The power conversion circuit of claim 1 , wherein the first and second semiconductor switches are metal oxide semiconductor field-effect transistors (MOSFETs) comprising a wide band gap semiconductor material.

9. The power conversion circuit of claim 8 , wherein the wide band gap semiconductor material is Silicon Carbide (SiC).

10. The power conversion circuit of claim 1 , including:

a first diode in parallel with a drain and a source of the first semiconductor switch; and

a second diode in parallel with a drain and a source of the second semiconductor switch.

11. The power conversion circuit of claim 10 , wherein the first and second diode are made of Silicon Carbide (SiC).

12. A method comprising:

driving, by a controller, a first power amplifier of a circuit, the circuit comprising:

a power loop;

the first power amplifier and a second power amplifier, wherein both the first power amplifier and the second power amplifier are electrically coupled to the controller;

a first semiconductor switch with a first gate electrically coupled to the first power amplifier; and

a second semiconductor switch with a first gate electrically coupled to the second power amplifier; and

a gate control loop located between the first power amplifier and the first semiconductor switch; and

passively driving the second semiconductor switch through a magnetic coupling between a parasitic inductance in the power loop and a parasitic inductance in the gate control loop,

wherein driving the first power amplifier creates a period of operational overlap for the first and second semiconductor switches by setting a gate voltage of the first semiconductor switch to an intermediate value above a threshold voltage of the first semiconductor switch.

13. The method of claim 12 , further comprising:

at a first time, setting the gate voltage of the first semiconductor switch to the intermediate value; and

at a second time, setting the gate voltage of the first semiconductor switch to a low value.

14. The method of claim 13 , wherein the second semiconductor switch is turned on by the magnetic coupling at a third time between the first time and the second time.

15. The method of claim 12 , wherein the threshold voltage is a minimum amount of charge define by operational characteristics of the first semiconductor switch that is required at the gate to provide a conductive path between a drain and a source of the first semiconductor switch.

16. The method of claim 12 , wherein during the period of operational overlap, a short-circuit occurs between a drain of the first semiconductor switch and ground of the power conversion circuit connected to a source of the second semiconductor switch.

17. The method of claim 16 , wherein the intermediate value is set to control a surge current during the short-circuit.

18. The method of claim 12 , wherein the first and second semiconductor switches are metal oxide semiconductor field-effect transistors (MOSFETs) comprising a wide band gap semiconductor material.

19. The method of claim 18 , wherein the wide band gap semiconductor material is Silicon Carbide (SiC).

20. The method of claim 12 , including:

a first diode in parallel with a drain and a source of the first semiconductor switch; and

a second diode in parallel with a drain and a source of the second semiconductor switch.