Cooling devices including a variable angle contact surface and methods for cooling heat-generating devices with a cooling device
A cooling device includes a substrate defining a substrate upper surface, and a fin positioned on the substrate upper surface, the fin including a deformable encapsulating layer coupled to the substrate upper surface and defining an interior region, and a phase-change material encapsulated within the interior region, where the phase-change material changes from a first matter phase to a second matter phase at a boiling point of a working fluid positioned on the deformable encapsulating layer.
1. A cooling device comprising:
a substrate defining a substrate upper surface;
a deformable encapsulating layer coupled to the substrate upper surface and defining an interior region; and
a phase-change material encapsulated within the interior region, wherein the phase-change material changes from a first matter phase to a second matter phase at a boiling point of a working fluid positioned on the deformable encapsulating layer.
2. The cooling device of claim 1 , wherein the phase-change material has a melting point that is within 5 degrees Celsius of the boiling point of the working fluid.
3. The cooling device of claim 1 , wherein the deformable encapsulating layer hermetically seals the phase-change material on the substrate upper surface to form a fin positioned on the substrate upper surface.
4. The cooling device of claim 1 , wherein the deformable encapsulating layer comprises a thickness that is less than 100 nanometers.
5. The cooling device of claim 1 , wherein the phase-change material comprises a static state thickness that is between 100 micrometers and 500 micrometers.
6. A system comprising:
a cooling device comprising:
a substrate defining a substrate upper surface;
a plurality of fins positioned on the substrate upper surface, each of the plurality of fins comprising:
a deformable encapsulating layer coupled to the substrate upper surface, wherein the deformable encapsulating layer is repositionable between a static position, in which the deformable encapsulating layer is oriented to face upward in a vertical direction, and a dynamic position, in which the deformable encapsulating layer defines at least one nucleation cavity extending inward and toward the substrate upper surface and at least one peak extending outward and away from the substrate upper surface; and
a working fluid positioned on the deformable encapsulating layer, wherein the working fluid comprises a boiling point and the deformable encapsulating layer transitions from the static position to the dynamic position at the boiling point of the working fluid.
7. The system of claim 6 , wherein the plurality of fins each further comprise a phase-change material positioned on the substrate upper surface and encapsulated by the deformable encapsulating layer, and wherein the phase-change material changes from a first matter phase to a second matter phase at the boiling point of the working fluid.
8. The system of claim 7 , wherein the phase-change material comprises a melting point that corresponds to the boiling point of the working fluid.
9. The system of claim 8 , wherein the phase-change material has a melting point that is within 5 degrees Celsius of the boiling point of the working fluid.
10. The system of claim 7 , wherein the phase-change material comprises a static state thickness that is between 100 micrometers and 500 micrometers.
11. The system of claim 6 , wherein the boiling point of the working fluid is less than an operating temperature of a heat-generating device coupled to the cooling device.
12. The system of claim 6 , wherein the deformable encapsulating layer comprises a thickness that is less than 100 nanometers.
13. The system of claim 6 , wherein the encapsulating layer comprises platinum.
14. A method for cooling a heat-generating device, the method comprising:
heating a substrate lower surface of a substrate with a heat-generating device;
transferring thermal energy from the substrate lower surface, through the substrate to a substrate upper surface positioned opposite the substrate lower surface;
heating an encapsulated phase-change material positioned on the substrate upper surface;
changing a matter phase of the encapsulated phase-change material;
heating a working fluid positioned on the encapsulated phase-change material; and
boiling the working fluid while changing the matter phase of the encapsulated phase-change material.
15. The method of claim 14 , wherein changing the matter phase of the encapsulated phase-change material comprises melting the encapsulated phase-change material.
16. The method of claim 15 , wherein the encapsulated phase-change material comprises a melting point that is within 5 degrees Celsius of a boiling point of the working fluid.
17. The method of claim 14 , wherein a boiling point of the working fluid is less than an operating temperature of the heat-generating device.
18. The method of claim 14 , wherein changing the matter phase of the encapsulated phase-change material further comprises elastically deforming a deformable encapsulating layer coupled to the substrate upper surface, the deformable encapsulating layer hermetically sealing the encapsulated phase-change material on the substrate upper surface.
19. The method of claim 18 , wherein elastically deforming the deformable encapsulating layer comprises forming at least one nucleation cavity extending inward and toward the substrate upper surface and at least one peak extending outward and away from the substrate upper surface.
20. The method of claim 18 , wherein elastically deforming the deformable encapsulating layer comprises changing a contact angle evaluated between the working fluid and the deformable encapsulating layer.