Wafer-to-design image analysis (WDIA) system

1. A method, comprising:

obtaining a layout of a circuit pattern implemented on a semiconductor wafer;

identifying one or more polygons in the layout based on a length criteria;

placing one or more measurement gauges on the one or more polygons identified in the layout;

obtaining a scanning electron microscope (SEM) image of the circuit pattern;

aligning the SEM image with the layout including the one or more polygons identified in the layout;

measuring a critical dimension of one or more objects in the SEM image, the one or more objects corresponding to the one or more polygons identified in the layout; and

determining whether the circuit pattern is acceptable based on the measured critical dimension, wherein identifying the one or more polygons in the layout based on the length criteria includes

identifying a first polygon having a length greater than a first threshold dimension, and

identifying a plurality of segments of the first polygon, each segment having a length equal to a second threshold dimension.

2. The method of claim 1 , wherein placing the one or more measurement gauges includes placing the measurement gauge in each segment of the plurality of segments of the first polygon.

3. The method of claim 1 , wherein each segment of the plurality of segments has a same width.

4. The method of claim 1 , wherein identifying the one or more polygons in the layout based on the length criteria further includes identifying a second polygon having a length greater than a third threshold dimension and less than the first threshold dimension.

5. The method of claim 4 , wherein placing the one or more measurement gauges includes placing a single measurement gauge on the second polygon.

6. The method of claim 1 , further comprising:

measuring critical dimensions of all segments of the plurality of segments in the first polygon;

generating a normal distribution of the critical dimensions;

calculating a mean value of the critical dimensions from the normal distribution;

comparing the measured critical dimension of the object with the mean value to obtain a comparison; and

determining whether the circuit pattern is acceptable based on the comparison.

7. The method of claim 6 , further comprising determining the circuit pattern is unacceptable when the measured critical dimension of the object is greater than the mean value.

8. The method of claim 6 , further comprising determining the circuit pattern is acceptable when the measured critical dimension of the object is less than the mean value.

9. A system, comprising:

a memory, storing instructions; and

at least one processor that executes the instructions to:

obtain a layout of a circuit pattern implemented on a semiconductor wafer;

identify a first polygon having a length greater than a first threshold dimension;

identify a plurality of segments of the first polygon, each segment having a length equal to a second threshold dimension;

place one or more measurement gauges on the first polygon;

align a scanning electron microscope (SEM) image of the circuit pattern with the layout including the first polygon including the one or more measurement gauges;

measure a critical dimension of one or more objects in the SEM image, the one or more objects corresponding to the first polygon including the one or more measurement gauges; and

determine whether the circuit pattern is acceptable based on the measured critical dimension.

10. The system of claim 9 , wherein the at least one processor executes the instructions to place a measurement gauge in each segment of the plurality of segments of the first polygon.

11. The system of claim 10 , wherein each segment of the plurality of segments has a same width.

12. The system of claim 10 , wherein the at least one processor executes the instructions to identify a second polygon having a length greater than a third threshold dimension and less than the first threshold dimension.

13. The system of claim 12 , wherein the at least one processor executes the instructions to place a single measurement gauge on the second polygon.

14. The system of claim 10 , wherein the at least one processor executes the instructions to:

measure critical dimensions of all segments of the plurality of segments in the first polygon;

generate a normal distribution of the critical dimensions;

calculate a mean value of the critical dimensions from the normal distribution;

compare the measured critical dimensions of the one or more object with the mean value to obtain a comparison; and

determine whether the circuit pattern is acceptable based on the comparison.

15. The system of claim 14 , wherein the at least one processor executes the instructions to determine the circuit pattern is unacceptable when the measured critical dimension of the object is greater than the mean value.

16. The system of claim 14 , wherein the at least one processor executes the instructions to determine the circuit pattern is acceptable when the measured critical dimension of the object is less than the mean value.

17. A non-transitory, computer-readable medium comprising instructions stored in a memory which, when executed by a processor cause a computer to perform a method, the method comprising:

obtaining a layout of a circuit pattern implemented on a semiconductor wafer;

identifying a first polygon having a length greater than a first threshold dimension;

identifying a plurality of segments of the first polygon, each segment having a length equal to a second threshold dimension;

placing one or more measurement gauges on the first polygon;

obtaining a scanning electron microscope (SEM) image of the circuit pattern;

aligning the SEM image with the layout including the first polygon including the one or more measurement gauges;

measuring a critical dimension of one or more objects in the SEM image, the one or more objects corresponding to the first polygon including the one or more measurement gauges;

measuring critical dimensions of all segments of the plurality of segments in the first polygon;

generating a normal distribution of the critical dimensions;

calculating a mean value of the critical dimensions from the normal distribution;

comparing the measured critical dimensions of the one or more object with the mean value to obtain a comparison; and

determining whether the circuit pattern is acceptable based on the comparison.

18. The non-transitory, computer-readable medium of claim 17 , further comprising:

identifying a second polygon having a length greater than a third value and less than the first threshold dimension.

19. The non-transitory, computer-readable medium of claim 18 , wherein placing the one or more measurement gauges includes:

placing the one or more measurement gauge in each segment of the plurality of segments of the first polygon; and

placing a single measurement gauge on the second polygon.