Cooling device
In order to enhance heat reception from a cooling target object by a heat sink to efficiently cool a device, the cooling target object, a cooling device including a heat sink and a fluid path is provided. Further, the heat sink includes a heat receiving face. The fluid path is formed so as to allow a predetermined fluid to pass therethrough. The heat exchange portion includes a first path arranged approximately in parallel to the heat receiving face of the heat sink.
1. A cooling device comprising:
a heat sink configured to be a block having a heat receiving face whose outer surface is configured to be placed in contact with an outer surface of a cooling target CPU (Central Processing Unit) via a heat spreader; and
a fluid path including a heat exchange portion, the fluid path being formed so as to allow a predetermined fluid to pass through the fluid path, the heat exchange portion including a first path configured to be inserted into the inside of the heat sink and thermally coupled to the heat sink, the first path configured to be arranged in parallel to the heat receiving face of the heat sink, wherein
the heat exchange portion includes a second path configured to be inserted into the inside of the heat sink and thermally coupled to the heat sink, the second path configured to be disposed at a position located farther from the heat receiving face than the first path, and the second path configured to be arranged side by side with the first path and receiving the predetermined fluid having passed through the first path, and
the first path and the second pathing having a tubular pipe-shaped structure, arranged linearly inside the heat sink and arranged parallel to each other inside the heat sink.
2. The cooling device according to claim 1 , wherein
the fluid path includes an intake port extending from the first path and a discharge port extending from the second path.
3. The cooling device according to claim 2 , wherein
the intake port and the discharge port are disposed outside of an apparatus in which the cooling target device is mounted.
4. The cooling device according to claim 1 , wherein
each of the first path and the second path is branched into a plurality of branched paths.
5. The cooling device according to claim 1 , wherein
the heat exchange portion includes a structure in which a plurality of pairs of the first path and the second path are coupled to one another, and
two successive pairs among the plurality of pairs of the first path and the second path are coupled to each other so as to allow the predetermined fluid having passed through the second path included in an upstream-side pair of any of the two successive pairs of the plurality of pairs of the first path and the second path to be conveyed into the first path included in a downstream-side pair of the any of the two successive pairs of the plurality of pairs of the first path and the second path.
6. The cooling device according to claim 1 , wherein portions of the first path and the second path are disposed outside of the heat sink.
7. The cooling device according to claim 1 , further comprising a pump that sends the predetermined fluid into the fluid path.
8. The cooling device according to claim 1 , wherein a portion of the fluid path is covered with a heat insulating material.
9. The cooling device according to claim 1 , wherein
the fluid path includes a plurality of second heat exchange portions, and each of the plurality of second heat exchange portions is thermally coupled to one or more of a plurality of second heat sinks thermally coupled to different cooling target devices.
10. A cooling device comprising:
a heat sink configured to be a block having a heat receiving face whose outer surface is configured to be placed in contact with an outer surface of a cooling target CPU (Central Processing Unit) via a heat spreader; and
a fluid path including a heat exchange portion, the fluid path being formed so as to allow a predetermined fluid to pass through the fluid path, the heat exchange portion including a plurality of first paths configured to be inserted into the inside of the heat sink and thermally coupled to the heat sink, and the plurality of first paths arranged in parallel to the heat receiving face of the heat sink,
wherein the heat exchange portion includes a plurality of second paths configured to be inserted into the inside of the heat sink and thermally coupled to the heat sink, the plurality of second paths disposed at a position located farther from the heat receiving face than the plurality of first paths, and each of the plurality of second paths configured to be connected to one of the plurality of first paths by a turning path and receiving the predetermined fluid having passed through one of the plurality of first paths, and
the plurality of first paths and the plurality of second paths having a pipe-shaped structure, arranged linearly inside the heat sink, and arranged parallel to each other inside the heat sink.