Joined body of piezoelectric single-crystal substrate and support substrate
A bonded body includes a supporting substrate; a piezoelectric single crystal substrate composed of a material selected from the group consisting of lithium niobate, lithium tantalate and lithium niobate-lithium tantalate; and an amorphous layer present between the supporting substrate and piezoelectric material substrate, and the amorphous layer contains one or more metal atoms selected from the group consisting of niobium and tantalum, an atom constituting the supporting substrate, and an argon atom. A concentration of the argon atom in a central part of the amorphous layer is higher than a concentration of the argon atom in a peripheral part of the amorphous layer.
1. A bonded body comprising:
a supporting substrate;
a piezoelectric single crystal substrate comprising a material selected from the group consisting of lithium niobate, lithium tantalate and lithium niobate-lithium tantalate; and
an amorphous layer present between said supporting substrate and said piezoelectric single crystal substrate, said amorphous layer comprising one or more metal atoms selected from the group consisting of niobium and tantalum, an atom constituting said supporting substrate, and an argon atom,
wherein a concentration of said argon atom in a central part of said amorphous layer viewed in a plan view to a thickness direction of said piezoelectric single crystal substrate is higher than a concentration of said argon atom in a peripheral part of said amorphous layer viewed in the plan view to the thickness direction of said piezoelectric single crystal substrate.
2. The bonded body of claim 1 , wherein a thickness of said central part of said amorphous layer is larger than a thickness of said peripheral part of said amorphous layer.
3. The bonded body of claim 1 , wherein said supporting substrate comprises silicon.
4. The bonded body of claim 1 , wherein said piezoelectric single crystal substrate has a thickness of 50 μm or smaller.