Method for determining a strength of a bond and/or a material as well as a bond tester apparatus
A method for testing a bond using a bond tester apparatus, the method comprising the steps of applying a mechanical force to the bond, determining, by a sensor component comprised by the bond tester apparatus, the applied force to the bond by measuring, by the sensor component, a displacement of the sensor component caused by the applied force and calculating, by the sensor component, the applied force on the basis of a first component which comprises a direct relationship with the measured displacement and on the basis of at least one of a second component, a third component and a fourth component.
1. A method for performing an application of force on a bond, comprising the steps of:
applying, using a test tool comprising a bond tester apparatus, a mechanical force to the bond;
determining, by a sensor component of the bond tester apparatus, the applied force to the bond by:
measuring, by the sensor component, a displacement of the sensor component caused by the applied force; and
calculating, by the sensor component, the applied force on the basis of a first component which comprises a direct relationship with the measured displacement and on the basis of at least one of:
a second component which comprises a direct relationship with a first derivative of the measured displacement over time;
a third component which comprises a direct relationship with a second derivative of the measured displacement over time; and
a fourth component which comprises a direct relationship with an acceleration of the sensor component;
wherein the first component comprises a spring coefficient times the measured displacement; and
wherein the spring coefficient is related to a constant characteristic of the sensor component.
2. The method according to claim 1 , wherein:
the applied force is calculated on the basis of at least the second component;
the second component comprises a damping coefficient times the first derivative of the measured displacement over time; and
the damping coefficient is related to damping and elastic forces of the sensor component.
3. The method according to claim 2 , further comprising the step of:
determining the damping coefficient using a free-body oscillation characteristic of the sensor component.
4. The method according to claim 1 , wherein:
the applied force is calculated on the basis of at least the third component;
the third component comprises a mass coefficient times the second derivative of the measured displacement over time; and
the mass coefficient is related to a mass of the sensor component.
5. The method according to claim 4 , further comprising the step of:
determining the mass coefficient using a free-body oscillation characteristic of the sensor component.
6. The method according to claim 1 , further comprising the step of:
determining the spring coefficient by applying a static force to the bond.
7. The method according to claim 1 , wherein the applied force is calculated based on the equation:
F
=
kx
+
b
dx
dt
+
m
d
2
x
dt
2
-
ma
,
wherein:
F is the applied force, k is the spring coefficient, x is the measured displacement, b is a damping coefficient, m is a mass coefficient, t is the time, and a is the acceleration of the sensor component.