Protective film-forming composition
A composition for forming protective films against aqueous hydrogen peroxide solutions, including: a compound of the following formula (1a) or formula (1b) or a compound having a substituent of the following formula (2) and having a molecular weight of 300 or more and less than 800 or a weight-average molecular weight of 300 or more and less than 800; and a solvent, the composition containing the compound of the formula (1a) or formula (1b) of 0.1% by mass to 60% by mass or the compound having the substituent of the formula (2) of 10% by mass to 100% by mass, relative to solids excluding the solvent: (wherein R 1 is a C 1-4 alkylene or alkenylene group or a direct bond, k is 0 or 1, m is an integer of 1 to 3, and n is an integer of 2 to 4.)
1. A composition for forming protective films against aqueous hydrogen peroxide solutions, the composition comprising:
a compound of the following formula (1a),
a compound of the following formula (1b), or
a compound of the following formula (2a-1) or
a compound having a substituent of the following formula (2) and having a molecular weight of 300 or more and less than 800 or a weight-average molecular weight of 300 or more and less than 800:
in which R 1 is a C 1-4 alkylene or alkenylene group or a direct bond, k is 0 or 1, m is an integer of 1 to 3, and n is an integer of 2 to 4; and
a solvent; wherein
the composition contains 0.1% by mass to 60% by mass of the compound of the formula (1a) or 0.1% by mass to 60% by mass of the compound of the formula (1b), relative to solids excluding the solvent, or
the composition contains 10% by mass to 100% by mass of the compound of the formula (2a-1) or 10% by mass to 100% by mass of the compound of the compound having the substituent of the formula (2), relative to solids excluding the solvent;
the compound of the formula (1a) is a compound selected from the group consisting of formula (1a-2), formula (1a-3), formula (1a-4), formula (1a-5), formula (1a-6), formula (1a-7), formula (1a-8), formula (1a-9), formula (1a-11), formula (1a-12), formula (1a-13), formula (1a-14), formula (1a-15), formula (1a-16) and formula (1a-18):
the compound of the formula (1b) is a compound selected from the group consisting of formula (1b-1), formula (1b-2), formula (1b-3), formula (1b-4), formula (1b-6), formula (1b-7), formula (1b-8), formula (1b-9), formula (1b-10), formula (1b-11), formula (1b-12), formula (1b-13), formula (1b-14), formula (1b-15), formula (1b-16), formula (1b-17), formula (1b-18), formula (1b-19), formula (1b-20), formula (1b-21), formula (1b-22), formula (1b-23), formula (1b-24), formula (1b-25), formula (1b-26), formula (1b-27), formula (1b-28), formula (1b-29), and formula (1b-30):
the substituent of the formula (2) is a substituent selected from the group consisting of formula (2-3), formula (2-5), formula (2-6), formula (2-7), formula (2-8), formula (2-9), formula (2-10), formula (2-11), formula (2-12), formula (2-13) and formula (2-14):
2. The composition for forming protective films against aqueous hydrogen peroxide solutions according to claim 1 , further comprising a compound having at least two of epoxy group, oxetanyl group, epoxycyclohexyl group, or epoxycyclopentyl group per molecule.
3. The composition for forming protective films against aqueous hydrogen peroxide solutions according to claim 1 , further comprising a compound having no phenolic hydroxy group, wherein the composition contains the compound of the formula (1a) or formula (1b) of 0.1% by mass to 60% by mass relative to the compound having no phenolic hydroxy group.
4. The composition for forming protective films against aqueous hydrogen peroxide solutions according to claim 3 , wherein the compound having no phenolic hydroxy group is a polymer.
5. A pattern formation method comprising:
a first step of forming a protective film on a semiconductor substrate by using the composition for forming protective films against aqueous hydrogen peroxide solutions according to claim 1 , wherein the semiconductor substrate optionally has an inorganic film formed on a surface of the semiconductor substrate;
a second step of forming a resist pattern on the protective film;
a third step of uncovering a surface of the inorganic film or the semiconductor substrate by dry-etching the protective film with the resist pattern serving as a mask; and
a fourth step of wet-etching and cleaning the inorganic film or the semiconductor substrate by using an aqueous hydrogen peroxide solution with the dry-etched protective film serving as a mask.
6. The composition for forming protective films against aqueous hydrogen peroxide solutions according to claim 1 , wherein the composition contains the compound of the formula (1a).
7. The composition for forming protective films against aqueous hydrogen peroxide solutions according to claim 1 , wherein the composition contains the compound of the formula (1b).
8. The composition for forming protective films against aqueous hydrogen peroxide solutions according to claim 1 , wherein the composition contains the compound of the formula (2a-1).
9. The composition for forming protective films against aqueous hydrogen peroxide solutions according to claim 1 , wherein the composition contains the compound having the substituent of the formula (2), the compound having the substituent of the formula (2) having a molecular weight of 300 or more and less than 800.
10. The composition for forming protective films against aqueous hydrogen peroxide solutions according to claim 1 , wherein the composition contains the compound having the substituent of the formula (2), the compound having the substituent of the formula (2) having a weight-average molecular weight of 300 or more and less than 800.