Laser annealing apparatus, inspection method of substrate with crystallized film, and manufacturing method of semiconductor device
A laser annealing apparatus ( 1 ) according to the embodiment includes: a laser beam source ( 11 ) configured to emit a laser beam (L 1 ) to crystallize an amorphous silicon film ( 101 a ) on a substrate ( 100 ) and to form a poly-silicon film ( 101 b ); a projection lens ( 13 ) configured to condense the laser beam to irradiate a silicon film ( 101 ); a probe beam source configured to emit a probe beam (L 2 ); a photodetector ( 25 ) configured to detect the probe beam (L 3 ) transmitted through the silicon film ( 101 ); a processing apparatus ( 26 ) configured to calculate a standard deviation of detection values of a detection signal output from the photodetector, and to determine a crystalline state of the crystallized film based on the standard deviation.
1. An inspection method of a substrate with a crystallized film, the method comprising the steps of:
(A) irradiating an amorphous film over the substrate with a laser beam to crystallize the amorphous film and to form the crystallized film;
(B) irradiating the crystallized film with a probe beam;
(C) detecting, by a photodetector, the probe beam transmitted through the crystallized film;
(D) changing an irradiation position of the probe beam onto the crystallized film to acquire a plurality of detection values of a detection signal from the photodetector; and
(E) determining, based on a standard deviation of the plurality of detection values, a crystalline state of the crystallized film,
wherein the laser beam passes through a projection lens and forms a linear irradiation region on the amorphous film by the projection lens, and
the photodetector detects the probe beam having passes through the projection lens.
2. The inspection method according to claim 1 , wherein the step (E) comprises:
comparing the standard deviation with a threshold; and
determining the substrate to be non-defective when the standard deviation is less than the threshold or determining the substrate to be defective when the standard deviation is equal to or greater than the threshold.
3. The inspection method according to claim 1 , wherein the step (E) further comprises determining the crystalline state based on an average value of the plurality of detection values.
4. The inspection method according to claim 1 , wherein
the probe beam forms a linear illumination region on the crystallized film, and
the probe beam transmitted through the crystallized film is condensed on the photodetector by a condenser lens.
5. The inspection method according to claim 1 , wherein the step (D) comprises conveying the substrate to change an irradiation position of the laser beam and the irradiation position of the probe beam while the substrate is being irradiated simultaneously with the laser beam and the probe beam.
6. The inspection method according to claim 1 , wherein
the step (A) comprises irradiating the amorphous film with the laser beam while the substrate placed over a stage is being moved,
the step (B) comprises irradiating the amorphous film with the probe beam outside the stage, and
the step (D) comprises carrying the substrate on the stage out by a robot hand to change the irradiation position of the probe beam.
7. The inspection method according to claim 6 , wherein the step (C) comprises detecting, by the photodetector, the probe beam having passed through the crystallized film twice or more.
8. A manufacturing method of a semiconductor device, the method comprising the steps of:
(a) forming an amorphous film over a substrate;
(b) irradiating the amorphous film with a laser beam to crystallize the amorphous film and to form a crystallized film;
(c) irradiating the crystallized film with a probe beam;
(d) detecting, by a photodetector, the probe beam transmitted through the crystallized film;
(e) changing an irradiation position of the probe beam onto the crystallized film to acquire a plurality of detection values of a detection signal output from the photodetector;
(f) determining, based on a standard deviation of the plurality of detection values, a crystalline state of the crystallized film; and
(g) re-irradiating the crystallized film with the laser beam according to a determination result of the crystalline state,
wherein the laser beam passes through a projection lens and forms a linear irradiation region on the amorphous film by the projection lens, and
the photodetector detects the probe beam having passes through the projection lens.
9. The manufacturing method according to claim 8 , wherein the step (f) comprises:
comparing the standard deviation with a threshold; and
determining the substrate to be non-defective when the standard deviation is less than the threshold or determining the substrate to be defective when the standard deviation is equal to or greater than the threshold.