Electronic package and method for fabricating the same
An electronic package and a method for fabricating the same are provided. A plurality of electronic components are disposed in a packaging structure. At least one antenna structure is stacked via a plurality of conductive elements on the packaging structure. The antenna structure is electrically connected to at least one of the electronic components. The electronic components have different radio frequencies. In mass production, the antenna structures of different antenna types are stacked on the packaging structure, and a radio frequency product of various frequencies can be produced. Radio frequency chips of different frequencies need not be fabricated into a variety of individual packaging modules. Therefore, the production cost is reduced, and the production speed is increased.
1. An electronic package, comprising:
a packaging structure, comprising:
a carrier disposed with a circuit layer and having a first surface and a second surface opposing the first surface; and
a plurality of electronic components disposed on the first surface of the carrier and electrically connected to the circuit layer, wherein the plurality of electronic components are radio frequency semiconductor chips; and
at least one antenna structure stacked via a plurality of conductive elements on the second surface of the carrier and electrically connected to the circuit layer and one of the plurality of electronic components without being connected to any other of the plurality of electronic components.
2. The electronic package of claim 1 , wherein the electronic components are different radio frequency chips.
3. The electronic package of claim 1 , wherein the antenna structure has a thickness corresponding to a radio frequency of the electronic components.
4. The electronic package of claim 1 , wherein a single one of the at least one antenna structure is stacked on the packaging structure and electrically connected to one of the electronic components.
5. The electronic package of claim 1 , wherein a plurality of the antenna structures are stacked on the packaging structure and arranged corresponding to the electronic components, and each of the antenna structures is electrically connected to each of the electronic components, respectively.
6. The electronic package of claim 1 , wherein an air gap is formed between the antenna structure and the packaging structure.
7. The electronic package of claim 1 , wherein the antenna structure includes an antenna portion, and wherein the antenna portion includes an insulating body and an antenna body, and the antenna body includes a first antenna layer and a second antenna layer formed on two opposing sides of the insulating body, respectively.
8. The electronic package of claim 7 , wherein the antenna structure further comprises:
a base portion bonded to the antenna portion and stacked via the conductive elements on the second surface of the carrier; and
a circuit portion disposed in the base portion and electrically connected to the circuit layer and the antenna portion.
9. The electronic package of claim 1 , wherein the antenna structure is an mm wave antenna plate.
10. The electronic package of claim 1 , further comprising a connector disposed on the carrier or on the antenna structure.
11. A method for fabricating an electronic package, comprising:
providing a packaging structure, the packaging structure comprising:
a carrier disposed with a circuit layer and a first surface and a second surface opposing the first surface; and
a plurality of electronic components disposed on the first surface of the carrier and electrically connected to the circuit layer, wherein the plurality of electronic components are radio frequency semiconductor chips; and
stacking at least one antenna structure via a plurality of conductive elements on the second surface of the carrier, and electrically connecting the at least one antenna structure to the circuit layer and one of the plurality of electronic components without being connected to any other of the plurality of electronic components.
12. The method of claim 11 , wherein the electronic components are different radio frequency chips.
13. The method of claim 11 , wherein the antenna structure has a thickness corresponding to a radio frequency of the electronic components.
14. The method of claim 11 , wherein a single one of the antenna structure is stacked on the packaging structure and electrically connected to one of the electronic components.
15. The method of claim 11 , wherein a plurality of the antenna structures are stacked on the packaging structure and arranged corresponding to the electronic components, and each of the antenna structures is electrically connected to each of the electronic components, respectively.
16. The method of claim 11 , wherein an air gap is formed between the antenna structure and the packaging structure.
17. The method of claim 11 , wherein the antenna structure includes an antenna portion, and wherein the antenna portion has an insulating body and an antenna body, and the antenna body has a first antenna layer and a second antenna layer formed on two opposing sides of the insulating body, respectively.
18. The method of claim 17 , wherein the antenna structure further comprises:
a base portion bonded to the antenna portion and stacked via the conductive elements on the second surface of the carrier; and
a circuit portion arranged in the base portion and electrically connected to the circuit layer and the antenna portion.
19. The method of claim 11 , wherein the antenna structure is an mm wave antenna plate.
20. The method of claim 11 , further comprising arranging a connector on the carrier or on the antenna structure.