Back-illuminated sensor and a method of manufacturing a sensor
An image sensor utilizes a pure boron layer and a second epitaxial layer having a p-type dopant concentration gradient to enhance sensing DUV, VUV or EUV radiation. Sensing (circuit) elements and associated metal interconnects are fabricated on an upper surface of a first epitaxial layer, then the second epitaxial layer is formed on a lower surface of the first epitaxial layer, and then a pure boron layer is formed on the second epitaxial layer. The p-type dopant concentration gradient is generated by systematically increasing a concentration of p-type dopant in the gas used during deposition/growth of the second epitaxial layer such that a lowest p-type dopant concentration of the second epitaxial layer occurs immediately adjacent to the interface with the first epitaxial layer, and such that a highest p-type dopant concentration of the second epitaxial layer occurs immediately adjacent to the interface with pure boron layer.
1. A method of fabricating an image sensor, the method comprising:
forming a first epitaxial layer on a substrate;
forming a circuit element on a first surface of the first epitaxial layer;
thinning the substrate to generate a thinned substrate, the thinned substrate exposing at least a surface portion of a second surface of the first epitaxial layer, said second surface being opposed to the first surface on which said circuit element is disposed;
forming a second epitaxial layer on the exposed portion of the first epitaxial layer; and
forming a pure boron layer on the second epitaxial layer,
wherein forming the second epitaxial layer includes generating a p-type dopant concentration gradient in the second epitaxial layer by gradually increasing a concentration of a p-type dopant used during formation of the second epitaxial layer such that a first layer portion of the second epitaxial layer has a lower p-type dopant concentration than a subsequently formed second layer portion of the second epitaxial layer, and a highest p-type dopant concentration of the second epitaxial layer is adjacent to the pure boron layer.
2. The method of claim 1 , wherein the p-type dopant comprises boron.
3. The method of claim 1 , wherein forming the second epitaxial layer comprises utilizing a gas containing elemental boron at a temperature lower than about 350° C.
4. The method of claim 3 , wherein forming the second epitaxial layer comprises growing said second epitaxial layer using molecular-beam epitaxial growth.
5. The method of claim 1 , wherein the method further comprises depositing an anti-reflection layer on a surface of the pure boron layer.
6. The method of claim 1 , wherein the method further comprises depositing a metal protective layer on the surface of the pure boron layer.
7. The method of claim 1 , wherein the method further comprises attaching a handling wafer to the first epitaxial layer over the circuit elements prior to thinning the substrate.
8. The method of claim 1 , wherein forming the second epitaxial layer comprises utilizing a plasma-enhanced chemical vapor deposition process at a temperature lower than about 450° C.
9. A method of fabricating an image sensor, the method comprising:
forming a first epitaxial layer on a substrate;
forming a circuit element on said first epitaxial layer;
thinning the substrate to generate a thinned substrate, the thinned substrate exposing at least a surface portion of the first epitaxial layer;
forming a second epitaxial layer on the exposed portion of the first epitaxial layer; and
forming a pure boron layer on the second epitaxial layer,
wherein forming the second epitaxial layer includes generating a p-type dopant concentration gradient in the second epitaxial layer by gradually increasing a concentration of a p-type dopant used during formation of the second epitaxial layer such that a first layer portion of the second epitaxial layer has a lower p-type dopant concentration than a subsequently formed second layer portion of the second epitaxial layer, and a highest p-type dopant concentration of the second epitaxial layer is adjacent to the pure boron layer, and
wherein the method further comprises:
attaching a handling wafer to the first epitaxial layer over the circuit elements prior to thinning the substrate, and
forming vias in at least one of the first epitaxial layer and the handling wafer prior to thinning the substrate.
10. The method of claim 9 , wherein the method further comprises exposing the vias after forming the pure boron layer.
11. The method of claim 9 , wherein the p-type dopant comprises boron.
12. The method of claim 9 , wherein forming the second epitaxial layer comprises utilizing a gas containing elemental boron at a temperature lower than about 350° C.
13. The method of claim 12 , wherein forming the second epitaxial layer comprises growing said second epitaxial layer using molecular-beam epitaxial growth.
14. The method of claim 9 , wherein the method further comprises depositing an anti-reflection layer on a surface of the pure boron layer.
15. The method of claim 9 , wherein the method further comprises depositing a metal protective layer on the surface of the pure boron layer.
16. The method of claim 9 , wherein forming the second epitaxial layer comprises utilizing a plasma-enhanced chemical vapor deposition process at a temperature lower than about 450° C.