IP Library Granted Patent US 11,114,747
Granted Patent B2
US 11,114,747 · App. 16/441,376 · Granted Sep 7, 2021

Antenna including conductive pattern and electronic device including the same

Inventors: Chungkyun Ham (Suwon-si, KR); Seunggil Jeon (Suwon-si, KR); Jaehun Jung (Suwon-si, KR); Youngsik Kim (Suwon-si, KR)
Assignee: Samsung Electronics Co., Ltd.
H01Q1/243H01Q5/42H01Q9/065H01Q9/42H01Q21/065H01Q21/28H05K1/16
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Quick Facts
Patent No.
US 11,114,747
App. No.
16/441,376
Granted
Sep 7, 2021
Kind
B2
Abstract

An electronic device is provided. The electronic device includes a housing including a first plate, a second plate facing away from the first plate, and a side member surrounding a space between the first plate and the second plate, a first PCB disposed in parallel with the first plate in the space between the first plate and the second plate, and including a first face facing the first plate and a second face facing the second plate, at least one conductive plate formed on the second face, a first conductive pattern embedded in the first PCB and disposed to be closer to a portion of the side member than the conductive plate when viewed from above the first plate, a first wireless communication circuit mounted on a first face of the first PCB, electrically coupled to the conductive plate and the first conductive pattern.

Claims (42)

1. An electronic device comprising:

a housing including a first plate, a second plate facing away from the first plate, and a side member surrounding a space between the first plate and the second plate;

a first printed circuit board (PCB) disposed in parallel with the first plate in the space between the first plate and the second plate, and including a first face facing the first plate and a second face facing the second plate;

at least one conductive plate formed on the second face;

a first conductive pattern embedded in the first PCB and disposed to be closer to a portion of the side member than the conductive plate when viewed from above the first plate;

a first wireless communication circuit mounted on a first face of the first PCB, electrically coupled to the conductive plate and the first conductive pattern, and configured to perform at least one of transmission and reception of a signal having a frequency in the range of about 6 GHz to 100 GHz;

a dielectric structure disposed on the first face between the conductive plate and the side member when viewed from above the first plate;

a second conductive pattern constructed on one face of the dielectric structure or embedded at least partially inside thereof; and

a second wireless communication circuit electrically coupled to the second conductive pattern and configured to perform at least one of transmission and reception of a signal having a frequency in the range of about 0.5 GHz to 6 GHz.

2. The electronic device of claim 1 , wherein the second wireless communication circuit is configured to support a Wi-Fi protocol.

3. The electronic device of claim 1 , wherein the first conductive pattern forms a dipole antenna.

4. The electronic device of claim 1 , further comprising a display disposed inside the space and visible through a portion of the first plate.

5. The electronic device of claim 1 , wherein the dielectric structure is disposed between the first plate and the first conductive pattern.

6. The electronic device of claim 1 , wherein the second conductive pattern is disposed at a location spaced apart from the at least one conductive plate in the dielectric structure so as to satisfy a specified radiation efficiency.

7. The electronic device of claim 1 , wherein the dielectric structure is disposed at a location at least partially overlapping with the first conductive pattern when viewed from above the first plate.

8. The electronic device of claim 1 ,

wherein the dielectric structure comprises:

a first face facing the first plate;

a second face facing the first face of the first PCB; and

a side face surrounding the first face and the second face, and

wherein the side face comprises:

a first side face facing the side member;

a second side face facing away from the first side face;

a third side face connecting the first side face and one end of the second side face; and

a fourth side face connecting the first side face and other end of the second side face.

9. The electronic device of claim 8 , wherein the second conductive pattern is disposed on the first face of the dielectric structure.

10. The electronic device of claim 8 , wherein the second conductive pattern is disposed on the dielectric structure to be extended through at least two faces among the first face, the second face, the first side face, the second side face, the third side face, or the fourth side face.

11. The electronic device of claim 8 , wherein the second conductive pattern is disposed on each of at least two faces among the first face, the second face, the first side face, the second side face, the third side face, or the fourth side face.

12. The electronic device of claim 1 , wherein the conductive plate is disposed such that a beam pattern is formed in a direction of the second plate, and the first conductive pattern is disposed such that a beam pattern is formed in a direction of the side member.

13. The electronic device of claim 1 , wherein the first conductive pattern comprises:

a first antenna element disposed in a direction of the side member at an edge region of the first PCB;

a second antenna element disposed with a specific interval from the first antenna element;

a third antenna element disposed between the first antenna element and the second antenna element; and

a fourth antenna element disposed with a specific interval in a horizontal direction from the third antenna element.

14. The electronic device of claim 13 , wherein the first antenna element and the second antenna element are constructed in a form of a conductive patch.

15. The electronic device of claim 1 , further comprising a second PCB disposed between the first plate and the second plate,

wherein the second wireless communication circuit is mounted to the second PCB.

16. The electronic device of claim 15 , wherein the second conductive pattern is electrically coupled to the second PCB by means of an electrical coupling member when the second PCB is disposed to the space of the electronic device.

17. The electronic device of claim 15 , wherein the first PCB is disposed to at least partially overlap with the second PCB.

18. The electronic device of claim 1 , wherein the second conductive pattern is constructed using a conductive plate attached to the dielectric structure, a conductive paint coated on the first dielectric structure, or laser direct structuring (LDS) in the dielectric structure.

19. The electronic device of claim 1 , wherein the first wireless communication circuit includes a radio frequency integrated circuit (RFIC).

20. The electronic device of claim 19 , further comprising an intermediate frequency integrated circuit (IFIC) electrically coupled to the first wireless communication circuit.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 14, 2019
From: HAM, CHUNGKYUN; JEON, SEUNGGIL; JUNG, JAEHUN; KIM, YOUNGSIK
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 049469/0218 →
Priority Claims (1)
KR 10-2018-0068292 · Jun 14, 2018 · national
Continuity (1)
Related Publication 20190386380A1 · Dec 19, 2019
Cited By (1)
US 12,658,566