IP Library › Granted Patent US 11,114,774
Granted Patent B2
US 11,114,774 · App. 16/689,240 · Granted Sep 7, 2021

Display device and manufacturing method thereof

Inventors: Dae Hyuk Im (Daegu, KR); Byoung Yong Kim (Seoul, KR)
Assignee: SAMSUNG DISPLAY CO., LTD.
H01R4/04H01R43/00H05K1/189H05K3/323H05K2201/0269H05K2201/0329H05K2201/10128H05K2203/107H05K2203/1136
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Quick Facts
Patent No.
US 11,114,774
App. No.
16/689,240
Granted
Sep 7, 2021
Kind
B2
Abstract

A display device includes a display panel. A flexible printed circuit board is electrically connected to the display panel. A first pad is disposed on the display panel. A second pad is disposed on the flexible printed circuit board and overlaps the first pad. A first anisotropic conductive film is disposed between the first pad and the second pad. The first anisotropic conductive film is configured to bond the first pad to the second pad. The first anisotropic conductive film includes a conductive polymer. The first anisotropic conductive film includes at least one first conductive region that electrically connects the first pad and the second pad and at least one first insulating region.

Claims (66)

1. A display device comprising:

a display panel;

a flexible primed circuit board electrically connected to the display panel a first pad disposed on the display panel;

a second pad disposed on the flexible printed circuit board and overlapping the first pad; and

a first anisotropic conductive film disposed between the first pad and the second pad, the first anisotropic conductive film configured to bond the first pad to the second pad;

wherein the first anisotropic conductive film includes a conductive polymer, and

the first anisotropic conductive film includes a first conductive region that is configured to electrically connect the first pad and the second pad and a first insulating region, and

wherein the first conductive region includes trans-polyacetylene, and

the first insulating, region includes cis-polyacetylene.

2. The display device of claim 1 , wherein

the first conductive region is disposed in a region where the first pad and the second pad overlap, and

the first insulating, region is disposed in a region surrounding the first conductive region.

3. The display device of claim 2 , wherein

the conductive polymer includes at least one among polyacetylene, polypyrrole, polythiophene, polyphenylene vinylene, and polyphenylene.

4. The display device of claim 2 , wherein

a pitch of the first pad is 27 μm or less.

5. The display device of claim 2 , further comprising:

a printed circuit board;

a third pad disposed on the flexible printed circuit board; and

a fourth pad disposed on the printed circuit board.

6. The display device of claim 5 , further comprising

a second anisotropic conductive film disposed between the third pad and the fourth pad, the second anisotropic conductive film configured to bond the third pad to the fourth pad.

7. The display device of claim 6 , wherein

the second anisotropic conductive film includes a conductive polymer.

8. The display device of claim 7 , wherein

the second anisotropic conductive film includes a second conductive region configured to electrically connect the third pad and the fourth pad and a second insulating region, and

the second conductive region is disposed in region where the third pad and the fourth pad overlap.

9. The display device of claim 8 , wherein

the flexible printed circuit board includes a data driver integrated circuit.

10. The display device of claim 9 , wherein

the data driver integrated circuit is configured to transmit a signal to the display panel through the second pad, the first anisotropic conductive film, and the first pad.

11. A display device comprising:

a display panel;

a flexible printed circuit board electrically connected to the display panel;

a first pad disposed on the display panel;

a second pad disposed on the flexible printed circuit board and overlapping the first pad; and

a first anisotropic conductive film disposed between the first pad and the second pad, the first anisotropic conductive film configured to bond the first pad to the second pad,

wherein the first anisotropic conductive film includes a first conductive region configured to electrically connect the first pad to the second pad and a first insulating region,

the first conductive region includes a polysilicon, and

the first insulating region includes an amorphous silicon.

12. The display device of claim 11 , wherein

the first conductive region is disposed in a region where the first pad and the second pad overlap, and

the first insulating region is disposed in a region surrounding the first conductive region.

13. The display device of claim 12 , wherein

the first anisotropic conductive film further includes a thermosetting resin or a photocurable resin.

14. The display device of claim 13 , further comprising:

a printed circuit board;

a third pad disposed on the flexible printed circuit board;

a fourth pad disposed on the printed circuit board; and

a second anisotropic conductive film disposed between the third pad and the fourth pad.

15. The display device of claim 14 , wherein

the second anisotropic conductive film includes a second conductive region that is configured to electrically connect the third pad to the fourth pad and a second insulating region,

the second conductive region includes a polysilicon, and

the second insulating region includes an amorphous silicon.

16. The display device of claim 15 , wherein

the second anisotropic conductive film further includes a thermosetting resin or a photocurable resin.

17. A manufacturing method of a display device, the method comprising:

providing a display panel and a flexible printed circuit board;

attaching an anisotropic conductive film to the display panel or the flexible printed circuit board;

providing a mask on the anisotropic conductive film, wherein the mask includes an opening in an area corresponding to a pad of the display panel or a pad of the flexible printed circuit board; and

irradiating a laser onto the anisotropic conductive film through the opening of the mask onto a region of the anisotropic conductive film that overlaps the pad of the display panel or the pad of the flexible printed circuit board, the laser increases a conductivity of the anisotropic conductive film to form a conductive region in a region that was irradiated by the laser and an insulating region in a region that was not irradiated by the laser.

18. The manufacturing method of claim 17 , wherein

the anisotropic conductive film includes a conductive polymer.

19. The manufacturing method of claim 17 , wherein

the region of the anisotropic conductive film to which the laser is irradiated includes a polysilicon, and

the region of the anisotropic conductive film to which the laser is not irradiated includes an amorphous silicon.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 20, 2019
From: IM, DAE HYUK; KIM, BYOUNG YONG
To: SAMSUNG DISPLAY CO., LTD.
Reel/Frame 051061/0804 →
Priority Claims (1)
KR 10-2018-0160209 · Dec 12, 2018 · national
Continuity (1)
Related Publication 20200194906A1 · Jun 18, 2020