Method for preparing a delivery system of one or more active ingredients in an edible composition

1. A method for preparing a first component of a comestible chewing gum, wherein the first component is an encapsulate composition including an active ingredient, comprising:

forming an extrudate of the first component via an extruder;

transporting said extrudate extruded from said extruder to a downstream processing machine;

actively cooling said extrudate from a temperature at an outlet of said extruder to a first temperature above a glass transition temperature of said first component, wherein said cooling said extrudate and said transporting said extrudate occur substantially simultaneously;

cutting said extrudate cooled to said first temperature into a plurality of pieces substantially identical in shape; and

further cooling said plurality of pieces to a second temperature, the first temperature being greater than the second temperature, wherein said second temperature is below said glass transition temperature of said first component.

2. The method according to claim 1 , wherein the first temperature is between 30° C. and 90° C.

3. The method according to claim 1 , wherein the second temperature is between 20° C. and 35° C.

4. The method according to claim 1 , wherein each of said pieces includes a cut surface having a diameter larger than a thickness of the piece, and a ratio of the diameter of said cut surface to said thickness is greater than 1.

5. The method according to claim 1 , further comprising:

grinding said plurality of pieces into a powder having particles of a desired size.

6. A method for preparing a first component of a chewing gum, comprising:

extruding an encapsulate composition including an active ingredient via an extrusion device;

actively cooling said encapsulate composition extruded from said extrusion device;

cutting said actively cooled encapsulate composition into a plurality of substantially identical pieces, wherein each piece includes a cut surface having a diameter larger than a thickness of the piece, and a ratio of the diameter of said cut surface to said thickness is greater than 1, wherein a temperature of said encapsulate composition during said actively cooled cutting is above a glass transition temperature of said encapsulate composition; and

further cooling said plurality of pieces to a temperature below said glass transition temperature of said encapsulate composition.

7. The method according to claim 6 , wherein the temperature of said encapsulate composition during said cutting is between 30° C. and 90° C.

8. The method according to claim 6 , wherein said plurality of pieces are cooled to said temperature between 20° C. and 35° C.

9. The method according to claim 6 , further comprising:

grinding said plurality of pieces into a powder having particles of a desired size.