MEMS-sensor
A MEMS sensor includes a housing with an interior volume, wherein the housing has an access port to the interior volume, a MEMS component in the housing, and a protection structure, which reduces an introduction of electromagnetic disturbance radiation with a wavelength in the range between 10 nm and 20 μm into the interior volume through the access port and reduces a propagation of the electromagnetic disturbance radiation in the interior volume.
1. A MEMS sensor comprising:
a housing enclosing an interior volume, wherein the housing comprises a substrate having an access port to the interior volume, and a covering element attached to the substrate;
a MEMS component in the interior volume of the housing; and
a protection structure comprising a first protection structure element covering the access port, wherein the first protection structure element is in contact with an external surface of the substrate, a second protection structure element extending across the access port, wherein the second protection structure element is embedded in the substrate, and a third protection structure element covering the access port, wherein the third protection structure element is in contact with an internal surface of the substrate, and wherein the first protection structure element, the second protection structure element, and the third protection structure element comprise the same material.
2. The MEMS sensor as claimed in claim 1 , wherein the housing is arranged on a carrier board comprising a further access port, wherein the further access port is arranged with a lateral offset to the access port of the substrate.
3. The MEMS sensor as claimed in claim 1 , wherein the first protection structure element, the second protection structure element, and the third protection structure element each comprises a layer-shaped protection structure element.
4. The MEMS sensor as claimed in claim 1 , wherein the first protection structure element, the second protection structure element, and the third protection structure element are parallel.
5. The MEMS sensor as claimed in claim 1 , further comprising a fourth protection structure element affixed to the MEMS component.
6. The MEMS sensor as claimed in claim 5 , wherein the fourth protection structure element is parallel to at least one of the first, second, and third protection structure elements.
7. The MEMS sensor as claimed in claim 5 , further comprising a fifth protection structure element affixed to an internal surface of the covering element.
8. The MEMS sensor as claimed in claim 7 , wherein the fifth protection structure element is parallel to a least one of the first, second, and third protection structure elements.
9. The MEMS sensor as claimed in claim 7 , further comprising an integrated circuit in the interior volume of the housing.
10. The MEMS sensor as claimed in claim 9 , further comprising a sixth protection structure element affixed to a sidewall of the integrated circuit.
11. The MEMS sensor as claimed in claim 10 , further comprising a seventh protection structure element between the integrated circuit and the substrate.