IP Library › Granted Patent US 11,118,262
Granted Patent B2
US 11,118,262 · App. 16/157,303 · Granted Sep 14, 2021

Substrate processing apparatus having a gas-mixing manifold

Inventors: Naoto Tsuji (Tokyo, JP); Masaki Hirayama (Miyagi, JP)
Assignee: ASM IP Holding B.V.
C23C16/45512B01F3/02B01F5/0057B01F5/0256C23C16/45536C23C16/45544C23C16/45561C23C16/45565C23C16/50H01J37/3244B01F15/00915
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Quick Facts
Patent No.
US 11,118,262
App. No.
16/157,303
Granted
Sep 14, 2021
Kind
B2
Abstract

A substrate processing apparatus includes a chamber, a manifold including a tubular portion above the chamber, first and second introduction pipes provided on a side surface of the tubular portion, and a gas guide portion to guide, in a direction opposite the chamber, gases introduced from the first and second introduction pipes into the tubular portion, and then introduce the gases into the chamber. The gas guide portion does not contact a top of the manifold, and the manifold includes a space above the gas guide portion to allow the gases to flow from between the gas guide portion and the tubular portion into a space surrounded by the gas guide portion. The gas guide portion advantageously enables the gases to broadly diffuse and uniformly mix, increasing the quality of a film formed on a substrate inside the chamber.

Claims (20)

1. A substrate processing apparatus comprising:

a chamber;

a manifold including a tubular portion provided above the chamber, a first introduction pipe provided on a side surface of the tubular portion, a second introduction pipe provided on the side surface of the tubular portion, and a gas guide portion configured to guide, in a direction opposite to the chamber, gases introduced from the first introduction pipe and the second introduction pipe into the tubular portion, and then introduce the gases into the chamber, the gas guide portion including a bottom plate portion having an opening at a center thereof and having an outer edge in contact with the tubular portion, and an inner tube having a bottom surface in contact with the bottom plate portion;

a first gas source configured to supply gas into the first introduction pipe;

a second gas source configured to supply gas into the second introduction pipe; and

a gate valve above the manifold, the gate valve configured to open and close a space above the bottom plate portion and the inner tube,

wherein the manifold includes a space disposed immediately above the gas guide portion such that the gases flow from between the gas guide portion and the tubular portion into a space surrounded by the gas guide portion, and the gas guide portion does not contact a top of the manifold.

2. The substrate processing apparatus according to claim 1 , further comprising a stage provided in the chamber, and a shower head provided in the chamber and configured to guide the gas provided from the manifold onto the stage.

3. The substrate processing apparatus according to claim 1 , wherein the first introduction pipe is configured to introduce gas to a center of the gas guide portion, and the second introduction pipe is configured to introduce gas to the center of the gas guide portion in a direction diametrically opposite to a gas introduction direction of the first introduction pipe.

4. The substrate processing apparatus according to claim 3 , wherein the first introduction pipe and the second introduction pipe are aligned with each other on a straight line in plan view.

5. The substrate processing apparatus according to claim 1 , wherein the first introduction pipe and the second introduction pipe introduce gas in a direction deviated from a center of the gas guide portion to generate a vortex between the gas guide portion and the tubular portion.

6. The substrate processing apparatus according to claim 5 , wherein the first introduction pipe and the second introduction pipe are parallel to each other with the center of the gas guide portion interposed therebetween in plan view.

7. The substrate processing apparatus according to claim 1 , wherein the first introduction pipe and the second introduction pipe are farther away from the chamber as the first introduction pipe and the second introduction pipe are closer to the tubular portion.

8. The substrate processing apparatus according to claim 1 , wherein a height of the inner tube is not less than 2.4 times a distance between the inner tube and the tubular portion.

9. The substrate processing apparatus according to claim 1 , wherein a height of the inner tube is not less than 2.8 times the distance between the inner tube and the tubular portion.

10. The substrate processing apparatus according to claim 1 , wherein the inner tube is configured in a cylindrical shape.

11. The substrate processing apparatus according to claim 1 , wherein a side surface of the inner tube is a curved surface.

12. The substrate processing apparatus according to claim 3 , wherein a side surface of the inner tube is a flat surface.

13. The substrate processing apparatus according to claim 1 , wherein the first gas source and the second gas source are configured to provide different gases.

14. The substrate processing apparatus according to claim 1 , wherein the gas guide portion has a side wall, and the side wall does not include a through-hole.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 11, 2018
From: TSUJI, NAOTO; HIRAYAMA, MASAKI
To: ASM IP HOLDING B.V.
Reel/Frame 047132/0132 →
Continuity (1)
Related Publication 20200115797A1 · Apr 16, 2020
Cited By (1)
US 12,637,765