Display panel manufacturing process and display panel

1. A display panel manufacturing process, comprising the steps of:

covering a substrate with a metal material layer to form a first metal layer located in a non-display area and a common line located in a display area;

forming a gate insulating layer on a first surface of the first metal layer, and etching off a portion of the gate insulating layer corresponding to a transfer pad to form a gate insulating recessed region;

forming a second metal layer on a first surface of the gate insulating layer, and etching off a portion of the second metal layer corresponding to the gate insulating recessed region to form a second metal recessed region;

forming a passivation layer on a first surface of the second metal layer, and etching off a portion of the passivation layer corresponding to the transfer pad to form a passivation recessed region, the width of the passivation recessed region being greater than the width of the second metal recessed region, and an exposed surface of the second metal layer being a second metal transfer pad;

forming a transparent electrode layer on the first surface of the second metal layer such that the transparent electrode layer covers the second metal transfer pad and the transparent electrode layer is in communication with the common line through the second metal transfer pad, to form a first substrate;

forming a second substrate provided with a common electrode; and

arranging an Au ball on a first surface of the transparent electrode layer, and enabling the Au ball to communicate the transparent electrode layer of the first substrate with the common electrode of the second substrate.

2. The display panel manufacturing process according to claim 1 , wherein the step of forming a transparent electrode layer on the first surface of the second metal layer such that the transparent electrode layer covers the second metal transfer pad and the transparent electrode layer is in communication with the common line through the second metal transfer pad comprises:

covering the surface of the first surface of the first metal layer corresponding to the transfer pad, side walls of the gate insulating layer and the second metal layer corresponding to the second metal recessed region, and the second metal transfer pad with the formed transparent electrode layer.

3. The display panel manufacturing process according to claim 1 , wherein the step of forming a transparent electrode layer on the first surface of the second metal layer such that the transparent electrode layer covers the second metal transfer pad and the transparent electrode layer is in communication with the common line through the second metal transfer pad comprises:

partially etching off a portion of the first metal layer corresponding to the transfer pad to form a first metal recessed region; and

covering the first metal recessed region, side walls of the gate insulating layer and the second metal layer corresponding to the second metal recessed region, and the second metal transfer pad with the formed transparent electrode layer.

4. The display panel manufacturing process according to claim 1 , wherein the first metal layer and the common line of the first substrate are formed by the same manufacturing process and are electrically connected to each other.

5. The display panel manufacturing process according to claim 1 , wherein the second metal layer and the common line of the first substrate are formed by the same manufacturing process and are electrically connected to each other.

6. The display panel manufacturing process according to claim 1 , wherein the common line of the first substrate and the first metal layer or the second metal layer are made through a same mask, and the first metal layer and the second metal layer are electrically connected through a via hole.

7. A display panel, comprising:

a first substrate;

a second substrate, arranged opposite to the first substrate, wherein

the first substrate comprises a common line, and the second substrate comprises a common electrode; and

an Au ball, arranged in a non-display area of the display panel, and conducting the common line of the first substrate and the common electrode of the second substrate, the Au ball being positioned at a transfer pad, wherein

the first substrate comprises:

a substrate;

a first metal layer, arranged on the substrate;

a gate insulating layer, arranged on a first surface of the first metal layer, and hollowed out corresponding to the transfer pad to form a gate insulating recessed region;

a second metal layer, arranged on a first surface of the gate insulating layer, a portion of the second metal layer corresponding to the gate insulating recessed region being hollowed out to form a second metal recessed region;

a passivation layer, arranged on a first surface of the second metal layer, a portion of the passivation layer corresponding to the gate insulating recessed region being hollowed out to form a passivation recessed region, the width of the passivation recessed region being greater than the width of the second metal recessed region, and an exposed surface of the second metal layer being a second metal transfer pad; and

a transparent electrode layer, covering the second metal transfer pad, the transparent electrode layer being in communication with the common line of the first substrate, wherein

the Au ball is arranged at a position of the transparent electrode layer corresponding to the second metal recessed region, and communicates the transparent electrode layer of the first substrate with the common electrode of the second substrate.

8. The display panel according to claim 7 , wherein the transparent electrode layer covers the second metal transfer pad, and meanwhile, covers the surface of the first metal layer, and side walls of sides of the gate insulating layer and the second metal layer corresponding to the second metal recessed region.

9. The display panel according to claim 7 , wherein

the first metal recessed region is located at a hollowed portion of the first metal layer corresponding to the transfer pad; and the transparent electrode layer covers the first metal recessed region, side walls of sides of the gate insulating layer and the second metal layer corresponding to the second metal recessed region, and the second metal transfer pad.

10. The display panel according to claim 7 , wherein the first metal layer and the common line of the first substrate are formed by the same manufacturing process and are electrically connected to each other.

11. The display panel according to claim 7 , wherein the second metal layer and the common line of the first substrate are formed by the same manufacturing process and are electrically connected to each other.

12. The display panel according to claim 7 , wherein the common line of the first substrate and the first metal layer or the second metal layer are made through a same mask, and the first metal layer and the second metal layer are electrically connected through a via hole.

13. The display panel according to claim 7 , wherein the first substrate is an array substrate, and the second substrate is a color filter substrate.

14. A display device, the display device comprising a display panel, wherein

the display panel comprises a first substrate;

a second substrate, arranged opposite to the first substrate, wherein

the first substrate comprises a common line, and the second substrate comprises a common electrode; and

an Au ball, arranged in a non-display area of the display panel, and conducting the common line of the first substrate and the common electrode of the second substrate, the Au ball being positioned at a transfer pad, wherein

the first substrate comprises:

a substrate;

a first metal layer, arranged on the substrate;

a gate insulating layer, arranged on a first surface of the first metal layer, and hollowed out corresponding to the transfer pad to form a gate insulating recessed region;

a second metal layer, arranged on a first surface of the gate insulating layer, a portion of the second metal layer corresponding to the gate insulating recessed region being hollowed out to form a second metal recessed region;

a passivation layer, arranged on a first surface of the second metal layer, a portion of the passivation layer corresponding to the gate insulating recessed region being hollowed out to form a passivation recessed region, the width of the passivation recessed region being greater than the width of the second metal recessed region, and an exposed surface of the second metal layer being a second metal transfer pad; and

a transparent electrode layer, covering the second metal transfer pad, the transparent electrode layer being in communication with the common line of the first substrate, wherein

the Au ball is arranged at a position of the transparent electrode layer corresponding to the second metal recessed region, and communicates the transparent electrode layer of the first substrate with the common electrode of the second substrate.

15. The display device according to claim 14 , wherein the transparent electrode layer covers the second metal transfer pad, and meanwhile, covers the surface of the first metal layer, and side walls of sides of the gate insulating layer and the second metal layer corresponding to the second metal recessed region.

16. The display device according to claim 14 , wherein the first metal recessed region is located at a hollowed portion of the first metal layer corresponding to the transfer pad; and the transparent electrode layer covers the first metal recessed region, side walls of sides of the gate insulating layer and the second metal layer corresponding to the second metal recessed region, and the second metal transfer pad.

17. The display device according to claim 14 , wherein the first metal layer and the common line of the first substrate are formed by the same manufacturing process and are electrically connected to each other.

18. The display device according to claim 14 , wherein the second metal layer and the common line of the first substrate are formed by the same manufacturing process and are electrically connected to each other.

19. The display device according to claim 14 , wherein the common line of the first substrate and the first metal layer or the second metal layer are made through a same mask, and the first metal layer and the second metal layer are electrically connected through a via hole.