Systems and methods for etching metals and metal derivatives
Exemplary etching methods may include flowing a halogen-containing precursor into a substrate processing region of a semiconductor processing chamber. The methods may include contacting a substrate housed in the substrate processing region with the halogen-containing precursor. The substrate may define an exposed region of a transition-metal-containing material. The methods may also include removing the transition-metal-containing material. The flowing and the contacting may be plasma-free operations.
1. An etching method comprising:
contacting a substrate housed in a substrate processing region of a semiconductor processing chamber with a plasma comprising one or more of oxygen, hydrogen, or nitrogen;
flowing a halogen-containing precursor into the substrate processing region, wherein the halogen-containing precursor comprises one or more materials selected from the group consisting of nitrogen trifluoride, diatomic fluorine, a precursor comprising carbon and fluorine, and chlorine trifluoride;
contacting the substrate with the halogen-containing precursor, wherein the substrate defines an exposed region of a transition-metal-containing material; and
removing the transition-metal-containing material, wherein the flowing the halogen-containing precursor and the contacting the substrate with the halogen-containing precursor comprise plasma-free operations.
2. The etching method of claim 1 , wherein the etching method is performed at a temperature greater than or about 200° C.
3. The etching method of claim 1 , wherein the etching method is performed at a pressure greater than or about 0.1 Torr.
4. The etching method of claim 3 , wherein the etching method is performed at a pressure less than or about 50 Torr.
5. The etching method of claim 1 , further comprising a post-treatment performed subsequent the etching method, wherein the post-treatment comprises contacting the substrate with a plasma comprising one or more of oxygen, hydrogen, or nitrogen.
6. The etching method of claim 1 , wherein the transition-metal-containing material comprises one or more of tungsten, molybdenum, titanium, or chromium.
7. The etching method of claim 6 , wherein the transition-metal-containing material is selected from the group consisting of tungsten, titanium nitride, molybdenum, tungsten silicide, molybdenum silicide, tungsten silicon nitride, tungsten silicon oxide, molybdenum silicon nitride, molybdenum silicon oxide, chromium, chromium silicide, tungsten chromium, and molybdenum chromium.
8. An etching method comprising:
flowing an oxygen-containing precursor into a substrate processing region of a semiconductor processing chamber;
contacting a substrate housed in the substrate processing region with the oxygen-containing precursor, wherein the substrate defines an exposed region of a transition-metal-containing material, and an exposed region of a tungsten-containing material;
oxidizing the exposed region of the transition-metal-containing material to produce an oxidized material;
flowing a halogen-containing precursor into the substrate processing region of the semiconductor processing chamber, wherein the halogen-containing precursor is characterized by a gas density greater than or about 5 g/L;
contacting the substrate with the halogen-containing precursor; and
removing the oxidized material, while substantially maintaining the exposed region of the tungsten-containing material.
9. The etching method of claim 8 , wherein the halogen-containing precursor comprises a transition metal.
10. The etching method of claim 9 , wherein the halogen-containing precursor comprises tungsten.
11. The etching method of claim 8 , wherein the transition-metal-containing material comprises titanium silicon nitride, tantalum silicon nitride, hafnium silicon oxide, hafnium silicon nitride, or molybdenum.
12. The etching method of claim 8 , wherein the halogen-containing precursor is maintained plasma free during the etching method.
13. The etching method of claim 8 , wherein the etching method is performed at a temperature greater than or about 200° C.
14. The etching method of claim 8 , wherein the etching method is performed at a pressure greater than or about 0.1 Torr.
15. The etching method of claim 14 , wherein the etching method is performed at a pressure less than or about 50 Torr.
16. The etching method of claim 8 , further comprising a pre-treatment performed prior to flowing the halogen-containing precursor, wherein the pre-treatment comprises contacting the substrate with a plasma comprising one or more of oxygen, hydrogen, or nitrogen.
17. The etching method of claim 8 , further comprising a post-treatment performed subsequent the etching method, wherein the post-treatment comprises contacting the substrate with a plasma comprising one or more of oxygen, hydrogen, or nitrogen.
18. The etching method of claim 8 , wherein the oxygen-containing precursor is plasma enhanced prior to contacting the substrate.