Method of manufacturing light emitting device that includes a first reflecting layer and a second reflecting layer

1. A method of manufacturing a light emitting device, the method comprising:

mounting a light emitting element in a package in which a recess is defined, the light emitting element being mounted on a bottom surface defining the recess;

forming a first reflecting layer by covering a lateral surface defining the recess with a first resin containing a first reflecting material;

forming a second reflecting layer covering the bottom surface defining the recess, wherein:

the step of forming the second reflecting layer comprises settling a second reflecting material in a second resin by a centrifugal force so as to form (i) a layer containing the second reflecting material on the bottom surface defining the recess, and (ii) a light-transmissive layer above the layer containing the second reflecting material,

after the step of forming the second reflecting layer, the second reflecting layer contacts the first reflecting layer and a lower portion of a lateral surface of the light emitting element, but does not contact an upper portion of the lateral surface of the light emitting element, and

after the step of forming the second reflecting layer, an entirety of the second reflecting layer is located below a plane in which an upper surface of the light emitting element extends; and

disposing a phosphor-containing layer on the second reflecting layer and the light emitting element, such that the phosphor-containing layer is in contact with the upper portion of the lateral surface of the light emitting element, wherein the phosphor-containing layer comprises a third resin that contains a phosphor.

2. The method of manufacturing a light emitting device according to claim 1 , wherein the second reflecting material is settled by applying the centrifugal force to the package about an axis of rotation such that the bottom surface defining the recess is positioned outward of the axis of rotation.

3. The method of manufacturing a light emitting device according to claim 1 , wherein the step of forming the second reflecting layer comprises curing the second resin while settling the second reflecting material.

4. The method of manufacturing a light emitting device according to claim 3 , wherein the second resin is cured at a temperature in a range of 40° C. to 200° C.

5. The method of manufacturing a light emitting device according to claim 1 , wherein the second reflecting material comprise titanium oxide.

6. The method of manufacturing a light emitting device according to claim 5 , wherein a particle size of the titanium oxide is in a range of 0.1 μm to 1.0 μm.

7. The method of manufacturing a light emitting device according to claim 1 , wherein a viscosity of the second resin is in a range of 0.3 Pa·s to 15 Pa·s.

8. The method of manufacturing a light emitting device according to claim 1 , further comprising:

before the step of forming the second reflecting layer, forming the second resin containing the second reflecting material by performing steps comprising:

mixing a base resin of a curable resin material and the second reflecting material to form a mixture, and

after allowing at least two hours to elapse, mixing a curing agent into the mixture.

9. A method of manufacturing a light emitting device, the method comprising:

mounting a light emitting element in a package in which a recess is defined, the light emitting element being mounted on a bottom surface defining the recess;

forming a first reflecting layer by covering a lateral surface defining the recess with a first resin containing a first reflecting material;

forming a second reflecting layer by covering the bottom surface defining the recess with a second resin containing a second reflecting material, wherein:

the step of forming the second reflecting layer comprises:

disposing the second resin on the bottom surface in the recess at a position between the lateral surface defining the recess and the light emitting element, by potting,

applying a centrifugal force to the package about an axis of rotation such that the bottom surface defining the recess is positioned outward of the axis of rotation, so as to change a shape of the second resin such that the second resin covers an entirety of the bottom surface defining the recess that is exposed from the first reflecting layer, and

curing the second resin while applying the centrifugal force,

after the step of forming the second reflecting layer, the second reflecting layer contacts the first reflecting layer and a lower portion of a lateral surface of the light emitting element, but does not contact an upper portion of the lateral surface of the light emitting element, and

after the step of forming the second reflecting layer, an entirety of the second reflecting layer is located below a plane in which an upper surface of the light emitting element extends;

disposing a phosphor-containing layer on the second reflecting layer and the light emitting element, such that the phosphor-containing layer is in contact with the upper portion of the lateral surface of the light emitting element, wherein the phosphor-containing layer comprises a third resin that contains a phosphor.

10. The method of manufacturing a light emitting device according to claim 9 , wherein the second resin is cured at a temperature in a range of 40° C. to 200° C.

11. The method of manufacturing a light emitting device according to claim 9 , wherein the second reflecting material comprise titanium oxide.

12. The method of manufacturing a light emitting device according to claim 11 , wherein a particle size of the titanium oxide is in a range of 0.1 μm to 1.0 μm.

13. The method of manufacturing a light emitting device according to claim 9 , wherein a viscosity of the second resin is in a range of 0.3 Pa·s to 15 Pa·s.

14. The method of manufacturing a light emitting device according to claim 9 , further comprising:

before the step of forming the second reflecting layer, forming the second resin containing the second reflecting material by performing steps comprising:

mixing a base resin of a curable resin material and the second reflecting material to form a mixture, and

after allowing at least two hours to elapse, mixing a curing agent into the mixture.

15. A method of manufacturing a light emitting device, the method comprising:

mounting a light emitting element in a package in which a recess is defined, the light emitting element being mounted on a bottom surface defining the recess;

forming a first reflecting layer by covering a lateral surface defining the recess with a first resin containing a first reflecting material;

forming a second resin containing a second reflecting material by performing steps comprising:

mixing a base resin of a curable resin material and the second reflecting material to form a mixture, and

after allowing at least two hours to elapse, mixing a curing agent into the mixture;

forming a second reflecting layer covering the bottom surface defining the recess, such that the second reflecting layer contacts the first reflecting layer, wherein the step of forming the second reflecting layer comprises settling the second reflecting material in the second resin by a centrifugal force so as to form (i) a layer containing the second reflecting material on the bottom surface defining the recess, and (ii) a light-transmissive layer above the layer containing the second reflecting material, and wherein at least a portion of a lateral surface of the light emitting element is not covered by the layer containing the second reflecting material; and

disposing a phosphor-containing layer on the second reflecting layer and the light emitting element, the phosphor-containing layer comprising a third resin that contains a phosphor.

16. A method of manufacturing a light emitting device, the method comprising:

mounting a light emitting element in a package in which a recess is defined, the light emitting element being mounted on a bottom surface defining the recess;

forming a first reflecting layer by covering a lateral surface defining the recess with a first resin containing a first reflecting material;

forming a second resin containing a second reflecting material by performing steps comprising:

mixing a base resin of a curable resin material and the second reflecting material to form a mixture, and

after allowing at least two hours to elapse, mixing a curing agent into the mixture;

forming a second reflecting layer by covering the bottom surface defining the recess with the second resin containing the second reflecting material, such that the second reflecting layer contacts the first reflecting layer, wherein the step of forming the second reflecting layer comprises:

disposing the second resin on the bottom surface in the recess at a position between the lateral surface defining the recess and the light emitting element, by potting,

applying a centrifugal force to the package about an axis of rotation such that the bottom surface defining the recess is positioned outward of the axis of rotation, so as to change a shape of the second resin such that the second resin covers an entirety of the bottom surface defining the recess that is exposed from the first reflecting layer, and

curing the second resin while applying the centrifugal force;

disposing a phosphor-containing layer on the second reflecting layer and the light emitting element, wherein the phosphor-containing layer comprises a third resin that contains a phosphor.