Middle-of-line contacts with varying contact area providing reduced contact resistance

1. A method of forming a semiconductor structure, comprising:

forming a first portion of at least one source/drain contact over at least one source/drain region of at least one fin-type field-effect transistor, the at least one source/drain region being formed over at least one fin providing at least one channel region of the at least one fin-type field-effect transistor, the at least one source/drain region being adjacent at least one gate spacer surrounding at least one gate region of the at least one fin-type field-effect transistor;

forming a first interlayer dielectric layer over the first portion of the at least one source/drain contact, the at least one gate spacer and the at least one gate region;

forming a second interlayer dielectric layer over the first interlayer dielectric layer;

forming a second portion of the at least one source/drain contact over the first portion of the at least one source/drain contact in a first opening in the first interlayer dielectric layer; and

forming a third portion of the at least one source/drain contact over the second portion of the at least one source/drain contact in a second opening in the second interlayer dielectric layer;

wherein the second opening is larger than the first opening; and

wherein top surfaces of the first portion of the at least one source/drain contact, the at least one gate spacer, and the at least one gate region are substantially coplanar.

2. The method of claim 1 , wherein the first interlayer dielectric layer comprises a nitride material and the second interlayer dielectric layer comprises an oxide material.

3. The method of claim 2 , wherein:

the nitride material comprises at least one of silicon nitride (SiN), silicon boron carbon nitride (SiBCN), silicon carbon nitride (SiCN), and silicon oxy-carbon nitride (SiOCN); and

the oxide material comprises silicon oxide (SiO x ).

4. The method of claim 1 , wherein the first interlayer dielectric layer has a first thickness and the second interlayer dielectric layer has a second thickness, the second thickness being greater than the first thickness.

5. The method of claim 1 , wherein a contact area of the first opening is smaller than a contact area between (i) the first portion of the at least one source/drain contact and (ii) the at least one source/drain region.

6. The method of claim 1 , wherein forming the first portion of the at least one source/drain contact comprises etching a third interlayer dielectric layer formed over the at least one source/drain region to expose a top surface of the at least one source/drain region.

7. The method of claim 1 wherein forming the second and third portions of the at least one source/drain contact comprises:

patterning a mask layer over a top surface of the second interlayer dielectric layer to expose at least a portion of the top surface of the second interlayer dielectric layer overlying the first portion of the at least one source/drain contact; and

etching portions of the first interlayer dielectric layer and the second interlayer dielectric layer exposed by the mask layer to form the first opening.

8. The method of claim 1 , wherein the at least one gate spacer has straight corners abutting the at least one gate spacer and the at least one gate region.

9. The method of claim 1 , wherein corners of the at least one gate spacer abutting the first portion of the at least one source/drain contact have a straight vertical profile.

10. A method of forming a semiconductor structure, comprising:

forming a first portion of at least one source/drain contact over at least one source/drain region of at least one fin-type field-effect transistor, the at least one source/drain region being formed over at least one fin providing at least one channel region of the at least one fin-type field-effect transistor, the at least one source/drain region being adjacent at least one gate spacer surrounding at least one gate region of the at least one fin-type field-effect transistor;

forming a first interlayer dielectric layer over the first portion of the at least one source/drain contact, the at least one gate spacer and the at least one gate region;

forming a second interlayer dielectric layer over the first interlayer dielectric layer;

forming a second portion of the at least one source/drain contact over the first portion of the at least one source/drain contact in a first opening in the first interlayer dielectric layer; and

forming a third portion of the at least one source/drain contact over the second portion of the at least one source/drain contact in a second opening in the second interlayer dielectric layer;

wherein the second opening is larger than the first opening;

wherein forming the first portion of the at least one source/drain contact comprises etching a third interlayer dielectric layer formed over the at least one source/drain region to expose a top surface of the at least one source/drain region; and

wherein etching the third interlayer dielectric layer erodes corners of the at least one gate spacer.

11. The method of claim 10 , wherein forming the first portion of the at least one source/drain contact further comprises:

depositing a contact material over the at least one source/drain region; and

planarizing the contact material, the at least one gate spacer and the at least one gate region, wherein planarizing the at least one gate spacer removes the eroded corners of the at least one gate spacer.

12. The method of claim 10 , wherein the first interlayer dielectric layer comprises a nitride material and the second interlayer dielectric layer comprises an oxide material.

13. The method of claim 12 , wherein:

the nitride material comprises at least one of silicon nitride (SiN), silicon boron carbon nitride (SiBCN), silicon carbon nitride (SiCN), and silicon oxy-carbon nitride (SiOCN); and

the oxide material comprises silicon oxide (SiO x ).

14. The method of claim 10 , wherein the first interlayer dielectric layer has a first thickness and the second interlayer dielectric layer has a second thickness, the second thickness being greater than the first thickness.

15. The method of claim 10 , wherein a contact area of the first opening is smaller than a contact area between (i) the first portion of the at least one source/drain contact and (ii) the at least one source/drain region.

16. A method of forming a semiconductor structure, comprising:

forming a first portion of at least one source/drain contact over at least one source/drain region of at least one fin-type field-effect transistor, the at least one source/drain region being formed over at least one fin providing at least one channel region of the at least one fin-type field-effect transistor, the at least one source/drain region being adjacent at least one gate spacer surrounding at least one gate region of the at least one fin-type field-effect transistor;

forming a first interlayer dielectric layer over the first portion of the at least one source/drain contact, the at least one gate spacer and the at least one gate region;

forming a second interlayer dielectric layer over the first interlayer dielectric layer;

forming a second portion of the at least one source/drain contact over the first portion of the at least one source/drain contact in a first opening in the first interlayer dielectric layer; and

forming a third portion of the at least one source/drain contact over the second portion of the at least one source/drain contact in a second opening in the second interlayer dielectric layer;

wherein the second opening is larger than the first opening;

wherein forming the second and third portions of the at least one source/drain contact comprises:

patterning a mask layer over a top surface of the second interlayer dielectric layer to expose at least a portion of the top surface of the second interlayer dielectric layer overlying the first portion of the at least one source/drain contact;

etching portions of the first interlayer dielectric layer and the second interlayer dielectric layer exposed by the mask layer to form the first opening;

selectively etching the second interlayer dielectric layer to enlarge the first opening to form the second opening in the second interlayer dielectric layer;

removing the mask layer; and

depositing a contact material in the first and second openings to form the second and third portions of the at least one source/drain contact.

17. The method of claim 16 , wherein the first interlayer dielectric layer comprises a nitride material and the second interlayer dielectric layer comprises an oxide material.

18. The method of claim 17 , wherein:

the nitride material comprises at least one of silicon nitride (SiN), silicon boron carbon nitride (SiBCN), silicon carbon nitride (SiCN), and silicon oxy-carbon nitride (SiOCN); and

the oxide material comprises silicon oxide (SiO x ).

19. The method of claim 16 , wherein the first interlayer dielectric layer has a first thickness and the second interlayer dielectric layer has a second thickness, the second thickness being greater than the first thickness.

20. The method of claim 16 , wherein a contact area of the first opening is smaller than a contact area between (i) the first portion of the at least one source/drain contact and (ii) the at least one source/drain region.