MEMS devices with an element having varying widths
A device includes a substrate, a routing conductive line over the substrate, a dielectric layer over the routing conductive line, and an etch stop layer over the dielectric layer. A Micro-Electro-Mechanical System (MEMS) device has a portion over the etch stop layer. A contact plug penetrates through the etch stop layer and the dielectric layer. The contact plug connects the portion of the MEMS device to the routing conductive line. An escort ring is disposed over the etch stop layer and under the MEMS device, wherein the escort ring encircles the contact plug.
1. A Micro-Electro-Mechanical System (MEMS) device comprising:
a first conductive line;
a first dielectric layer over the first conductive line;
a second dielectric layer over the first dielectric layer;
a second conductive line over the second dielectric layer;
a first escort ring over the second dielectric layer, wherein the first escort ring and the second conductive line are made of a same material; and
a first MEMS element extending through the second dielectric layer and the first dielectric layer to the first conductive line, wherein the first MEMS element extends through the first escort ring, wherein a first width of the first MEMS element extending through the first dielectric layer is greater than a second width of the first MEMS element extending through the second dielectric layer.
2. The MEMS device of claim 1 , wherein a difference between the first width and the second width is in a range from 500 Å to 2,000 Å.
3. The MEMS device of claim 1 , wherein a third width of the first MEMS element extending through the first escort ring is about a same width as the second width of the first MEMS element extending through the second dielectric layer.
4. The MEMS device of claim 1 , wherein the first MEMS element has a third width above the first escort ring, wherein a difference between the second width and the third width is in a range from 500 Å to 2,000 Å.
5. The MEMS device of claim 1 , wherein the first MEMS element is electrically coupled to the first escort ring.
6. The MEMS device of claim 1 , wherein the first MEMS element extends over the second conductive line, wherein a void is interposed between the first MEMS element and the second conductive line.
7. The MEMS device of claim 6 , wherein the second conductive line is exposed to the void.
8. A Micro-Electro-Mechanical System (MEMS) device comprising:
a first conductive line;
a first dielectric layer over the first conductive line;
a second dielectric layer over the first dielectric layer;
a second conductive line over the second dielectric layer; and
a first MEMS element having a contact plug and conductive pattern, the conductive pattern being capacitively coupled to the second conductive line, the contact plug extending through the second dielectric layer and the first dielectric layer to the first conductive line, wherein a portion of the second dielectric layer is interposed between a first section of the first MEMS element and a second section of the first MEMS element; and
a first escort ring over the second dielectric layer, wherein a portion of the first escort ring is interposed between the first section of the first MEMS element and the second section of the first MEMS element.
9. The MEMS device of claim 8 , wherein a sidewall of the second dielectric layer is tapered.
10. The MEMS device of claim 8 , wherein the first escort ring is conductive.
11. The MEMS device of claim 10 , wherein the first escort ring and the second conductive line have a same material construction.
12. The MEMS device of claim 8 , wherein the first escort ring surrounds the contact plug in a plan view.
13. The MEMS device of claim 8 , wherein the contact plug has a first width between opposing sidewalls of the first escort ring and a second width above the first escort ring, wherein the second width is greater than the first width.
14. The MEMS device of claim 8 , wherein the contact plug has a first width between opposing sidewalls of the first escort ring and a second width between opposing sidewalls of the first dielectric layer, wherein the second width is greater than the first width.
15. The MEMS device of claim 14 , wherein the contact plug has a third width above the first escort ring, wherein the third width is greater than the first width.
16. A Micro-Electro-Mechanical System (MEMS) device comprising:
a first conductive line;
a first dielectric layer over the first conductive line;
a second dielectric layer over the first dielectric layer;
a second conductive line over the second dielectric layer;
a first MEMS element having a conductive pattern and a contact plug, the conductive pattern being capacitively coupled to the second conductive line, the contact plug extending from the conductive pattern through the second dielectric layer and the first dielectric layer to the first conductive line, wherein a portion of the second dielectric layer is interposed between a first section of the contact plug and a second section of the contact plug; and
an intermediate conductive element over the second dielectric layer, wherein the intermediate conductive element is in physical contact with the contact plug.
17. The MEMS device of claim 16 , wherein a difference in a width of the contact plug above the intermediate conductive element and a width of the contact plug extending through the intermediate conductive element is in a range from 500 Å to 2,000 Å.
18. The MEMS device of claim 16 , wherein the intermediate conductive element forms a ring around the contact plug in a plan view.
19. The MEMS device of claim 16 , wherein a width of the contact plug extending through the intermediate conductive element is less than a width of the contact plug extending through the first dielectric layer.
20. The MEMS device of claim 16 , wherein a width of the contact plug extending through the second dielectric layer is less than a width of the contact plug extending through the first dielectric layer.