Connecting arrangement for the adhesive connection of a positionally sensitive element to a receiving body
A bonding arrangement and a method for the adhesive bonding of a position-sensitive element to a receiving body, in particular of an optical element, such as a semiconductor light source, a reflector, or the like, wherein a UV-curable adhesive is arranged between the position-sensitive element and the receiving body. Provision is made that the bond between the position-sensitive element and the receiving body has at least one cavity for accommodating the UV-curable adhesive and at least one retaining element that extends into the cavity and projects into the UV-curable adhesive. The cavity has a bottom section that is designed to be sufficiently thin-walled that the adhesive can be cured with UV light that can be radiated through the bottom section.
1. A bonding arrangement for an adhesive bonding of a position-sensitive element to a receiving body of an optical element, the bonding arrangement comprising:
a UV-curable adhesive arranged between the position-sensitive element and the receiving body;
at least one cavity for accommodating the UV-curable adhesive; and
at least one retaining element that extends into the cavity and projects into the UV-curable adhesive,
wherein the cavity has a bottom section that is provided at a deepest point of the cavity, and wherein an entirety of the bottom section is configured to be sufficiently thin-walled such that the UV-curable adhesive is cured with UV light that is radiated through the bottom section, and
wherein the cavity is fully enclosed except for an opening at an upper end of the cavity, wherein the opening opposes the bottom section.
2. The bonding arrangement according to claim 1 , wherein the cavity is at least partially filled with the UV-curable adhesive, and wherein a structural adhesive is additionally contained in the cavity.
3. The bonding arrangement according to claim 2 , wherein the structural adhesive is added to the surface of the UV-curable adhesive, and wherein portions of the retaining element pass through the structural adhesive.
4. The bonding arrangement according to claim 1 , wherein the cavity is formed on the receiving body or on the position-sensitive element.
5. The bonding arrangement according to claim 1 , wherein the retaining element is formed on the position-sensitive element or on the receiving body.
6. The bonding arrangement according to claim 1 , wherein the bottom section has a thickness of 20 μm to 500 μm, or of 50 μm to 200 μm, or of about 100 μm.
7. The bonding arrangement according to claim 1 , wherein the bottom section is formed as a single piece with and of uniform material with the receiving body or wherein the bottom section is formed as a single piece with and of uniform material with the position-sensitive element.
8. The bonding arrangement according to claim 1 , wherein the receiving body has a polymer-based plastic including a BMC.
9. The bonding arrangement according to claim 1 , wherein the optical element is a semiconductor light source or a reflector.
10. A method for producing a bonding arrangement for an adhesive bonding of a position-sensitive element to a receiving body of an optical element, the method comprising:
arranging a UV-curable adhesive between the position-sensitive element and the receiving body;
forming a cavity on the receiving body or on the position-sensitive element;
forming a retaining element on the position-sensitive element or on the receiving body;
inserting the retaining element in the cavity;
filling the cavity, at least partially, with the UV-curable adhesive so that the retaining element projects into the UV-curable adhesive; and
irradiating the UV-curable adhesive via UV light through a thin-walled bottom section of the cavity,
wherein the bottom section is provided at a deepest point of the cavity, and an entirety of the bottom section is thin-walled such that the UV-curable adhesive is cured with the UV light that is radiated through the bottom section, and
wherein the cavity is fully enclosed except for an opening at an upper end of the cavity, wherein the opening opposes the bottom section.
11. The method according to claim 10 , wherein a structural adhesive is additionally placed in the cavity.