Uniform work function metal recess for vertical transistor complementary metal oxide semiconductor technology
A semiconductor device includes a first transistor including a first vertical fin arranged between first bottom source or drain (S/D) region and first top S/D region, and a first recessed gate stack arranged on a sidewall of the first vertical fin. A second transistor includes second vertical fin arranged between a second bottom S/D region and second top S/D region, and a second recessed gate stack arranged on a sidewall of the second vertical fin. A first spacer contacts the sidewall of the first vertical fin and on the first recessed gate stack or the second recessed gate stack. A second spacer contacts the first spacer of the first transistor or the second transistor. The second spacer is on a sidewall of the top S/D region of the first transistor or second transistor. The inner spacer and the outer spacer include different materials.
1. A semiconductor device comprising:
a first transistor comprising a first vertical fin arranged between a first bottom source or drain (S/D) region and a first top S/D region, and a first recessed gate stack arranged on a sidewall of the first vertical fin;
a second transistor comprising a second vertical fin arranged between a second bottom S/D region and a second top S/D region, and a second recessed gate stack arranged on a sidewall of the second vertical fin;
a first spacer in contact with the sidewall of the first vertical fin, the first spacer further arranged on the first recessed gate stack of the first transistor, and the first spacer further arranged on the second recessed gate stack of the second transistor; and
a second spacer in contact with the first spacer of the first transistor or the second transistor, the second spacer further arranged on a sidewall of the first top S/D) region of the first transistor, and the second spacer further arranged on a sidewall of the second top S/D of the second transistor,
wherein the first spacer and the second spacer comprise different materials.
2. The semiconductor device of claim 1 , wherein the recessed gate stack of the first transistor and the gate stack of the second transistor comprise different thicknesses.
3. The semiconductor device of claim 1 , wherein the first transistor is an NFET, and the second transistor is a PFET.
4. The semiconductor device of claim 1 , wherein the second spacer is arranged adjacent to the first spacer.
5. The semiconductor device of claim 1 , wherein the second spacer is arranged over the gate stack of the first transistor, and the second spacer is arranged over the gate stack of the second transistor.
6. A semiconductor device of claim 1 , wherein the first top S/D region of the first transistor and the second top S/D of the second transistor have different volumes.