Modular piezoelectric sensor array with co-integrated electronics and beamforming channels
A modular array includes modular array includes one or more array modules. Each array module includes one or more transducer arrays, where each of the one or more transducer arrays includes a plurality of piezoelectric elements; a conducting interposer arranged and configured to provide acoustic absorbing backing for the one or more transducer arrays; and one or more Application Specific Integrated Circuits (ASICs). The conducting interposer and the one or more ASICs are in electrical contact with each other at a first direct electrical interface. Additionally, the conducting interposer and the one or more transducer arrays are in electrical contact with each other at a second direct electrical interface.
1. A modular array comprising:
one or more array modules, wherein each array module includes
one or more transducer arrays, wherein each of the one or more transducer arrays comprises a plurality of piezoelectric elements;
a conducting interposer arranged and configured to provide acoustic absorbing backing for the one or more transducer arrays; and
one or more Application Specific Integrated Circuits (ASICs);
wherein the conducting interposer and the one or more ASICs are in electrical contact with each other at a first direct electrical interface;
wherein the conducting interposer and the one or more transducer arrays are in electrical contact with each other at a second direct electrical interface; and
wherein a height of the conducting interposer is between 5λ, and 20λ, and λ, is a wavelength of an ultrasound beam emitted by the modular array.
2. The modular array of claim 1 , wherein a width of the modular array along an azimuthal direction and a height of the modular array along an elevation direction are roughly equal.
3. The modular array of claim 1 , wherein a width of the modular array along an azimuthal direction is greater than two times a height of the modular array along an elevation direction.
4. The modular array of claim 1 , wherein pitches of the conducting interposer along azimuthal and elevation directions match respective pitches of a transducer array of the one or more transducer arrays.
5. The modular array of claim 1 , wherein the plurality of piezoelectric elements comprises
a composite of PMN-PT or PIN-PMN-PT piezoelectric material, and insulating filler material.
6. The modular array of claim 5 , wherein
the insulating filler material comprises a non-conducting epoxy, and the non-conducting epoxy includes one or more of a plasticizer, or scattering balloons.
7. The modular array of claim 1 , wherein at least one of the one or more transducer arrays comprises multiple acoustic matching layers.
8. The modular array of claim 1 , wherein the conducting interposer comprises an electrically insulating grid frame with holes, and
a conducting material that is acoustically attenuating and fills the holes of the electrically insulating grid frame.
9. The modular array of claim 8 , wherein a width along an elevation direction and a width along an azimuthal direction of the conducting material within the holes are each at least 90% of respective pitches of a transducer array of the one or more transducer arrays.
10. The modular array of claim 8 , wherein
the electrically insulating grid frame comprises a non-conducting material that is configured to suppress transmission of lateral acoustic modes.
11. The modular array of claim 10 , wherein the non-conducting material
comprises one or more of a solid epoxy, an epoxy with a plasticizer, or an epoxy with scattering balloons.
12. The modular array of claim 10 , wherein the conducting material has a same acoustic impedance as the non-conducting material.
13. The modular array of claim 8 , wherein the conducting material comprises scattering balloons.
14. The modular array of claim 8 , wherein the first direct electrical interface comprises a silver loaded epoxy that is plated with a layer of nickel and a layer of gold.
15. The modular array of claim 14 , wherein the layer of nickel is plated with a layer of palladium.
16. The modular array of claim 1 , wherein the first direct electrical interface comprises a laminated layer of copper that is plated with a layer of nickel and a layer of gold.
17. The modular array of claim 1 , wherein a surface of the conducting interposer adjacent the first direct electrical interface comprises a crossing pattern of slots that are filled by silver loaded epoxy.
18. The modular array of claim 1 , wherein the height of the conducting interposer is uniform.
19. The modular array of claim 1 , wherein the height of the conducting interposer is realized by stacking a plurality of thinner conducting interposers.
20. The modular array of claim 1 , further comprising:
support structures that respectively support the each of one or more transducer arrays and
a gimbal system mechanically coupled to the support structures and configured to cause,
when actuated, changes in position and orientation of the each of one or more transducer arrays.