IP Library › Granted Patent US 11,137,296
Granted Patent B2
US 11,137,296 · App. 16/426,463 · Granted Oct 5, 2021

Force sensor with MEMS-based device and force touching member

Inventors: Li-Tien Tseng (Taoyuan, TW); Yu-Hao Chien (Taipei, TW); Chih-Liang Kuo (Hsinchu, TW); Yu-Te Yeh (Hsinchu, TW)
Assignee: MIRAMEMS SENSING TECHNOLOGY CO., LTD
G01L1/142B81B3/0072B81B2203/0376B81B2203/0392
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,137,296
App. No.
16/426,463
Granted
Oct 5, 2021
Kind
B2
Abstract

A force sensor includes a package substrate, a MEMS-based device, a package body and a force touching member. The MEMS-based device is disposed on the package substrate and electrically connected with the package substrate. The package body encapsulates the MEMS-based device. The force touching member including a rod is disposed on the package body and corresponding to the MEMS-based device. The force sensor allows a greater assembly tolerance.

Claims (13)

1. A force sensor with a force touching member, comprising:

a package substrate;

a microelectromechanical system (MEMS)-based device disposed on the package substrate and electrically connected with the package substrate, wherein the MEMS-based device includes a MEMS element providing a deformable area; and

a package body encapsulating the MEMS-based device,

wherein the force touching member includes a rod for pressing disposed on the package body and the rod corresponds to a geometric center of the deformable area of the MEMS element of the MEMS-based device, and

wherein the package body is filled between the rod and the deformable area.

2. The force sensor with a force touching member according to claim 1 , wherein a top surface of the rod is a planar surface or a curved surface.

3. The force sensor with a force touching member according to claim 1 , wherein the rod is made of a metallic material or a polymeric material.

4. The force sensor with a force touching member according to claim 1 , wherein the rod has a plate interposed between the rod and the package body or disposed on the rod.

5. The force sensor with a force touching member according to claim 4 , wherein a projection area of the plate is equal to or smaller than the MEMS-based device.

6. The force sensor with a force touching member according to claim 4 , wherein the plate is interposed between the rod and the package body and covers the package body.

7. The force sensor with a force touching member according to claim 4 , wherein the plate is disposed on the rod and has a connection leg, which is connected to the package body.

8. The force sensor with a force touching member according to claim 1 , wherein the force touching member is an extension of the package body.

Assignments (2)
CHANGE OF ADDRESS Recorded Feb 11, 2020
From: MIRAMEMS SENSING TECHNOLOGY CO., LTD
To: MIRAMEMS SENSING TECHNOLOGY CO., LTD
Reel/Frame 051897/0368 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 6, 2019
From: TSENG, LI-TIEN; CHIEN, YU-HAO; KUO, CHIH-LIANG; YEH, YU-TE
To: MIRAMEMS SENSING TECHNOLOGY CO., LTD
Reel/Frame 049394/0756 →
Priority Claims (1)
CN 201810537745.X · May 30, 2018 · national
Continuity (1)
Related Publication 20190368951A1 · Dec 5, 2019