Electronic component and module including the same
An electronic component includes a piezoelectric substrate, a first functional element, a first wiring, insulating films, a first conductive film, and a first external connection terminal. The first functional element is disposed on the piezoelectric substrate. The first wiring is disposed on the piezoelectric substrate, and is electrically connected to the first functional element. The insulating films are disposed on the piezoelectric substrate, and define a first hollow portion in which the first functional element is included. The first conductive film is disposed on the insulating films, and has a portion that passes through the insulating films and is electrically connected to the first wiring. The first external connection terminal is provided on the first conductive film, and is disposed at a position overlapping at least a portion of the first functional element in a plan view as viewed in the thickness direction of the piezoelectric substrate.
1. An electronic component comprising:
a piezoelectric substrate;
a first functional element provided on the piezoelectric substrate;
a first wiring provided on the piezoelectric substrate and electrically connected to the first functional element;
an insulating film provided on the piezoelectric substrate and defining a first hollow portion in which the first functional element is disposed;
a first conductive film provided on the insulating film and including a portion that passes through the insulating film and is electrically connected to the first wiring; and
a first external connection terminal provided on the first conductive film and located at a position overlapping at least a portion of the first functional element in a plan view as viewed from a thickness direction of the piezoelectric substrate; wherein
the first external connection terminal is in direct contact with the first conductive film.
2. The electronic component according to claim 1 , wherein
a first hole portion opened toward the first hollow portion is provided in the insulating film; and
the first conductive film is located at a position overlapping the first hole portion in the plan view.
3. The electronic component according to claim 2 , wherein
the insulating film includes:
a first cover defining the first hollow portion; and
a second cover covering the first cover; and
the first hole portion is provided in the first cover, and is located at a position overlapping the second cover and the first conductive film in the plan view.
4. The electronic component according to claim 3 , wherein the first hole portion is covered and sealed by the second cover.
5. The electronic component according to claim 1 , further comprising:
a second functional element provided on the piezoelectric substrate and electrically connected in series with the first functional element; and
a second wiring provided on the piezoelectric substrate and connected between the first functional element and the second functional element; wherein
the insulating film further defines a second hollow portion in which the second functional element is included; and
the electronic component further includes:
a second conductive film provided on the insulating film and electrically isolated from the second wiring; and
a second external connection terminal provided on the second conductive film and located at a position overlapping at least a portion of the second wiring in the plan view.
6. The electronic component according to claim 5 , wherein
the insulating film includes first and second hole portions that open toward the first and second hollow portions, respectively;
the first conductive film is located at a position overlapping the first hole portion in the plan view; and
the second conductive film is located at a position overlapping the second hole portion in the plan view.
7. The electronic component according to claim 6 , wherein
the insulating film includes:
a first cover defining the first and second hollow portions; and
a second cover covering the first cover;
the first hole portion is provided in the first cover, and is located at a position overlapping the second cover and the first conductive film in the plan view; and
the second hole portion is provided in the first cover, and is located at a position overlapping the second cover and the second conductive film in the plan view.
8. The electronic component according to claim 5 , wherein the second conductive film is located at a position overlapping at least a portion of the second wiring and the second functional element in the plan view.
9. The electronic component according to claim 5 , wherein at least one of the first functional element and the second functional element is a surface acoustic wave resonator.
10. The electronic component according to claim 5 , wherein the first functional element and the second functional element are included in a plurality of surface acoustic wave resonators that are connected to each other in a ladder topology.
11. A module comprising:
a circuit board including a wiring provided on at least a surface of the circuit board; and
the electronic component according to claim 1 ; wherein
the electronic component is flip-chip mounted on the circuit board.
12. The module according to claim 11 , further comprising:
a sealing material provided on the circuit board; wherein
the sealing material seals the electronic component.
13. The module according to claim 12 , wherein the sealing material covers the first functional element and the first wiring.
14. The electronic component according to claim 1 , wherein the first functional element is a surface acoustic wave resonator.
15. The electronic component according to claim 1 , wherein the insulating film has a same or substantially a same shape as a main surface of the piezoelectric substrate.
16. The electronic component according to claim 1 , wherein the conductive film electrically connects the first external connection terminal and the first wiring.