Method for improving catalytic activity
The present invention relates to a method for improving the catalytic activity of an oxygen evolution reaction (OER) catalyst comprising a substrate with a catalytic metallic composite coating. The method comprises exposing the metallic composite coating to a reducing agent to thereby increase oxygen vacancy density in the metallic composite coating.
1. A method for improving the catalytic activity of an oxygen evolution reaction (OER) catalyst, the OER catalyst comprising a porous substrate with a porous catalytic metallic composite coating, the method comprising:
exposing the porous metallic composite coating to a reducing agent in solution at a temperature of between 10° C. and 50° C., wherein the porous metallic composite coating is a nickel-iron composite; and
reducing the nickel-iron composite upon the exposing of the porous metallic composite coating to the reducing agent so as to form a reduced nickel-iron composite having an increased oxygen vacancy density in the reduced nickel-iron composite as compared to the nickel-iron composite.
2. The method according to claim 1 , wherein the nickel-iron composite comprises a nickel-iron oxide, a nickel-iron hydroxide, or a mixture thereof.
3. The method according to claim 1 , wherein the nickel-iron composite has a formula of Ni 2x Fe 3y (OH) 2x+3y , wherein x is a number between about 0.1 and about 2 and y is a number between about 0.1 and about 2.
4. The method according to claim 1 , wherein the metallic composite coating is amorphous.
5. The method according to claim 4 , wherein the amorphous metallic composite coating comprises nanosheets, nanoflakes, or a combination thereof.
6. The method according to claim 1 , wherein the metallic composite coating is crystalline.
7. The method according to claim 1 , wherein the reducing agent is sodium borohydride (NaBH 4 ).
8. The method according to claim 1 , wherein the substrate is an electrically conductive substrate.
9. The method according to claim 8 , wherein the electrically conductive substrate is nickel foam.