Silicon carbide semiconductor component with edge termination structure
A semiconductor component includes a SiC semiconductor body having an active region and an edge termination structure at least partly surrounding the active region. A drift zone of a first conductivity type is formed in the SiC semiconductor body. The edge termination structure includes: a first doped region of a second conductivity type between a first surface of the SiC semiconductor body and the drift zone, the first doped region at least partly surrounding the active region and being spaced apart from the first surface; a plurality of second doped regions of the second conductivity type between the first surface and the first doped region; and third doped regions of the first conductivity type separating adjacent second doped regions of the plurality of second doped regions from one another in a lateral direction.
1. A semiconductor component, comprising:
a SiC semiconductor body having an active region and an edge termination structure at least partly surrounding the active region, wherein in the SiC semiconductor body a drift zone of a first conductivity type is formed and the edge termination structure comprises:
a first doped region of a second conductivity type between a first surface of the SiC semiconductor body and the drift zone, the first doped region at least partly surrounding the active region and being spaced apart from the first surface;
a plurality of second doped regions of the second conductivity type between the first surface and the first doped region; and
third doped regions of the first conductivity type separating adjacent second doped regions of the plurality of second doped regions from one another in a lateral direction.
2. The semiconductor component of claim 1 , wherein each of the third doped regions is completely enclosed by the first doped region and the plurality of second doped regions.
3. The semiconductor component of claim 1 , wherein a vertical extent of the edge termination structure is at least 80% and at most 100% of a distance between a lower edge of a deepest doped region of the second conductivity type within the active region.
4. The semiconductor component of claim 1 , wherein a dopant dose of the plurality of second doped regions is higher than a dopant dose of the first doped region.
5. The semiconductor component of claim 1 , wherein the active region comprises further doped regions of the second conductivity type, and wherein a vertical extent of the edge termination structure is at least 80% of a distance between a deepest lower edge of the further doped regions in the active region and the first surface.
6. The semiconductor component of claim 5 , wherein the active region comprises transistor cells comprising body regions of the second conductivity type, and wherein the vertical extent of the edge termination structure is at least 80% of a distance between the first surface and a lower edge of the body regions.
7. The semiconductor component of claim 1 , wherein the active region comprises transistor cells comprising body regions of the second conductivity type, wherein the transistor cells comprise shielding regions of the second conductivity type, and wherein a distance between a lower edge of the shielding regions and the first surface is greater than a vertical extent of gate structures of the transistor cells.
8. The semiconductor component of claim 7 , wherein the vertical extent of the edge termination structure is at least 80% of the distance between the first surface and a lower edge of the shielding regions.
9. The semiconductor component of claim 1 , wherein the active region comprises a plurality of anode regions and channel sections between the anode regions, and wherein the channel sections adjoin the first surface and form Schottky contacts to a first load electrode.
10. The semiconductor component of claim 1 , wherein a dopant concentration of the third doped regions is equal to a dopant concentration of the drift zone.
11. The semiconductor component of claim 1 , wherein the third doped regions comprise dopants of the second conductivity type and a dopant concentration of the second conductivity type is equal to a dopant concentration in the first doped region.
12. The semiconductor component of claim 1 , wherein a dopant dose for the first doped region is in a range of 2×10 12 cm −2 to 2×10 13 cm −2 and/or a dopant concentration of the second doped regions is at least 1×10 17 cm −3 .
13. The semiconductor component of claim 1 , wherein within the plurality of second doped regions, a dopant concentration is constant in a lateral direction.
14. The semiconductor component of claim 1 , wherein the active region comprises further doped regions of the second conductivity type or a plurality of anode regions and channel sections between the anode regions, and wherein the further doped regions or the plurality of anode regions comprise highly doped subregions and a dopant concentration of the highly doped subregions is equal to the dopant concentration in the plurality of second doped regions.
15. The semiconductor component of claim 1 , wherein a lateral width of the plurality of second doped regions decreases with increasing distance from the active region.
16. The semiconductor component of claim 1 , further comprising substructures, wherein each of the substructures is formed from one of the second doped regions and one of the third regions which adjoins the second doped region on a side facing away from the active region, and wherein a width of the substructures is constant.
17. A semiconductor component, comprising:
a SiC semiconductor body having an active region and an edge termination structure at least partly surrounding the active region, wherein in the SiC semiconductor body a drift zone of a first conductivity type is formed and the edge termination structure comprises:
a first doped region of a second conductivity type between a first surface of the SiC semiconductor body and the drift zone, the first doped region at least partly surrounding the active region and being spaced apart from the first surface;
a plurality of second doped regions of the second conductivity type between the first surface and the first doped region; and
a third doped region between adjacent second doped regions of the plurality of second doped regions.
18. The semiconductor component of claim 17 , wherein a lateral net dopant concentration in the plurality of second doped regions continuously decreases within a lateral distance of at least 200 nm from a maximum net dopant concentration Nmax to a concentration Nmax/e, wherein e is Euler's number.
19. The semiconductor component of claim 17 , wherein each third doped region is of the second conductivity type and a dopant concentration in each third doped region is at most 50% of a dopant concentration in the plurality of second doped regions.
20. The semiconductor component of claim 17 , wherein each third doped region is of the second conductivity type and a dopant concentration in each third doped region is equal to the dopant concentration in the first doped region.