Hot-melt adhesive resin film and production method thereof
The present invention relates to a hot-melt adhesive resin film having an excellent adhesive force and durability to various adherends such as metal, glass, and plastic, and a production method thereof. More particularly, the present invention relates to a hot-melt adhesive resin film including a first surface layer, a first intermediate layer, a substrate layer having heat resistance, a second intermediate layer, and a second surface layer, which are laminated in this order, in which the first intermediate layer and the second intermediate layer include a resin which is obtained by modifying a copolymer of propylene and 1-butene with maleic acid, and a production method thereof.
1. A hot-melt adhesive resin film comprising a first surface layer, a first intermediate layer, a substrate layer having heat resistance, a second intermediate layer, and a second surface layer, which are laminated in this order,
wherein said first intermediate layer and said second intermediate layer consist of a resin which is obtained by modifying a copolymer of propylene and 1-butene with maleic acid, and
said first surface layer and said second surface layer include a composition having an acid-modified polyolefin resin (A) having a melting point of 140° C. to 180° C. and a phenol novolak epoxy resin (C) which is solid at an ambient temperature or a composition having an acid-modified polyolefin resin (A) having a melting point of 140° C. to 180° C. and an oxazoline-group containing resin.
2. The hot-melt adhesive resin film according to claim 1 , wherein said first surface layer and said second surface layer contain 90 parts by mass to 99.9 parts by mass of the acid-modified polyolefin resin (A), and 0.1 parts by mass to 10 parts by mass of the phenol novolak epoxy resin (C).
3. The hot-melt adhesive resin film according to claim 1 , wherein said first surface layer and said second surface layer contain 80 parts by mass to 99.9 parts by mass of the acid-modified polyolefin resin (A) and 0.1 to 20 parts by mass of an oxazoline group-containing styrene-based resin (D) having a number average molecular weight of 50,000 to 250,000 as the oxazoline-group containing resin.
4. The hot-melt adhesive resin film according to claim 1 , wherein said first intermediate layer and said second intermediate layer are layers which are formed by coating and drying a solution including said resin which is obtained by modifying a copolymer of propylene and 1-butene with maleic acid, and which have a film thickness after drying of 1 μm to 5 μm.
5. The hot-melt adhesive resin film according to claim 1 , wherein said substrate layer is one selected from the group consisting of polyethylene naphthalate, a cyclic olefin polymer, and a methylpentene polymer.
6. The hot-melt adhesive resin film according to claim 1 , wherein said substrate layer comprises an inorganic filler.
7. A method of producing the hot-melt adhesive resin film of claim 1 , the method comprising the steps of:
coating a solution comprising the resin which has been obtained by modifying a copolymer of propylene and 1-butene with maleic acid on a first surface and an opposite second surface of the substrate layer to form a coated film;
drying said coated film to form said first intermediate layer and said second intermediate layer;
forming said first surface layer and said second surface layer by melt flow casting of the composition having an acid-modified polyolefin resin (A) having a melting point of 140° C. to 180° C. and a phenol novolak epoxy resin (C) which is solid at an ambient temperature, or melt flow casting of the composition having an acid-modified polyolefin resin (A) having a melting point of 140° C. to 180° C. and an oxazoline-group containing resin; and
sticking said first surface layer to said first intermediate layer and said second surface layer to said second intermediate layer.