System, apparatus and method for hybrid function micro welding
An apparatus, system and method for micro welding, wherein insulated object, such as a wire, that includes a metallic conductor that is at least partially covered by one or more layers of insulation, is positioned across a termination point. A laser beam may be applied to an area of the insulated object overlapping the termination point, wherein the applied laser beam is configured to substantially simultaneously (i) ablate the one or more layers of insulation in a first region of the area, (ii) weld the metallic conductor to the termination point in a second region of the area, and (iii) detach a portion of the object from the termination point in a third region of the area.
1. A method for micro welding, comprising:
positioning an insulated wire, having a metallic conductor and one or more layers of insulation, proximate to a termination point; and
asymmetrically heating an area comprising the insulated wire and at least a portion of the termination point via an angled, single step laser shot to substantially simultaneously generate a plurality of asymmetrical heating regions in the area, wherein a first of the heating regions at least partially ablates the one or more layers of insulation, a second of the heating regions welds the metallic conductor to the termination point, and a third of the heating regions detaches a detachment portion of the wire.
2. The method of claim 1 , further comprising controlling the angle of the laser shot based on an optically assessment of the heating regions.
3. The method of claim 1 , wherein the area comprises at least an edge of the termination point.
4. The method of claim 1 , wherein the heating the area comprises heating the first of the heating regions via conductive heat outside a focus of the laser shot.
5. The method of claim 4 , wherein the heating the area comprises heating the second of the heating regions and the third of the heating regions via a focus of the laser shot.
6. The method of claim 1 , wherein the heating the area comprises heating via the laser shot having a wavelength between 500 nm and 1300 nm.
7. The method of claim 1 , wherein the laser shot comprises a solid state laser.
8. A method for micro welding, comprising:
positioning an insulated wire, comprising one or more layers of insulation, across a termination point;
angularly applying a laser beam to an area of the insulated wire and the termination point, wherein the applied laser beam is applied in a single operational process step to asymmetrically heat the area to:
ablate the one or more layers of insulation in a first region of the area,
weld the wire to the termination point in a second region of the area, and
detach the wire from the termination point in a third region of the area.
9. The method of claim 8 , further comprising controlling the angle of the laser beam based on an infrared assessment of the regions.
10. The method of claim 8 , wherein the area comprises an edge of the termination point.
11. The method of claim 10 , wherein the applied laser beam further heats the first region via conductive heat outside a focus of the laser beam.
12. The method of claim 11 , wherein the applied laser beam further heats the second region and the third region via the focus of the laser beam.
13. The method of claim 8 , wherein the applied laser beam comprises a wavelength between 500 nm and 1300 nm.
14. The method of claim 8 , wherein the applied laser beam comprises a solid state laser.
15. A micro welded apparatus, comprising:
an insulated object, comprising a metallic conductor at least partially covered by one or more layers of insulation, wherein the insulated object is asymmetrically heated to partially ablate, weld and detach to a termination point by a single angled laser shot to an area of the insulated object overlapping the termination point, wherein the angled laser shot substantially simultaneously (i) ablates the one or more layers of insulation in a first region of the area, (ii) welds the metallic conductor to the termination point in a second region of the area, and (iii) detaches a portion of the object from the termination point in a third region of the area.
16. The apparatus of claim 15 , further comprising a computer-driven infrared monitor suitable to monitor the first, second and third regions.
17. The apparatus of claim 15 , wherein the area comprises an edge of the termination point.
18. The apparatus of claim 15 , wherein the applied laser shot heats the first region via conductive heat outside a focus of the laser.
19. The apparatus of claim 18 , wherein the applied laser shot heats the second region and the third region via the focus of the laser.
20. The apparatus of claim 15 , further comprising a computer-driven optical monitor suitable to monitor the first, second and third regions.