System and method for transferring an EMV chip from a first card to a second card

1. A method for transferring an EMV chip from a first card to a second card, the method comprising the steps of:

obtaining the first card having the EMV chip itself bonded directly to a first body of the first card in a first receptacle thereby making a bond directly between the EMV chip and the first body, an adhesive being used to fixedly secure the EMV chip to provide said bond, said adhesive needing applied heat in order to subsequently weaken said bond once adhered, the adhesive affixing a back surface of the EMV chip with an opposing surface of the first body in the first receptacle, the first body having a first body surface substantially parallel with a planar top surface of the EMV chip;

heating the first body of the first card in a vicinity of the EMV chip so as to cause a weakening in the adhesive of said bond of the EMV chip with the first body as well as a softening of the first body about an entrance of the first receptacle, the first body extending around the first receptacle in order to form the receptacle;

bending the first body surface of the first body adjacent to the EMV chip, such that first body surface adjacent to the first receptacle becomes non parallel with the planar top surface of the EMV chip, the planar top surface having a metal contact surface, said bending causing a release of said bond between the back surface and the opposing surface;

removing the EMV chip from the first receptacle while the top surface remains bent and while maintaining a structural integrity of the EMV chip including the planar top surface;

positioning an applied adhesive between the back surface of the EMV chip and an opposing surface of a second receptacle of the second card, the second receptacle in a second body of the second card the EMV chip retaining the planar top surface in order to continue to maintain the structure integrity of the EMV chip when positioned in the second receptacle; and

maintaining the EMV chip in the second receptacle until the applied adhesive has cured.

2. The method of claim 1 further comprising the step of sandwiching the EMV chip between a block and the opposing surface of the second receptacle, such that a block body of the block overlaps both the EMV chip and a second body surface of the second body, the second body surface extending about the second receptacle.

3. The method of claim 2 , wherein the second body surface is part of a top surface of the second body of the second card.

4. The method of claim 2 further comprising applying a force to the block body, in order to provide a pressure simultaneously to both the second body surface and the EMV chip.

5. The method of claim 1 , wherein the applied adhesive is SUPER X 8008.

6. The method of claim 1 further comprising the step of applying heat to the first body of the first card in order to reduce warping of the first body introduced during at least one of said heating and said bending.

7. The method of claim 1 further comprising the step of applying heat to the first body of the first card in order to reduce stresses in the first body introduced during at least one of said heating and said bending.

8. The method of claim 1 , wherein said bending is applied on at least one side of the receptacle.

9. The method of claim 1 , wherein said bending is applied on a pair of opposing sides of the receptacle.

10. The method of claim 1 , wherein said bending is applied on a pair of adjacent sides of the receptacle.

11. The method of claim 1 , wherein the first body is composed of a plastic material and the second body is composed of a metallic material.

12. The method of claim 1 , wherein the card is a credit card.

13. The method of claim 1 , wherein the card is a debit card.