IP Library › Granted Patent US 12,202,293
Granted Patent B2
US 12,202,293 · App. 17/592,979 · Granted Jan 21, 2025

Method for making a metallic credit card

Inventor: Travis Jean (Meridian, ID)
Assignee: Travis Jean LLC
B42D25/475B42D25/373B42D25/425B42D25/465G06K19/0772G06K19/07743G06K19/07747
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Quick Facts
Patent No.
US 12,202,293
App. No.
17/592,979
Granted
Jan 21, 2025
Kind
B2
Abstract

A method of making a metallic credit card from an existing plastic credit card including the steps of cutting the existing plastic credit card from each side edge, peeling the plastic top layer from its bottom plastic substrate, removing its EMV chip, and attaching it to a metallic substrate. The metallic substrate can further be laser engraved with the user's personal information.

Claims (27)

1. A method of making a metallic credit card comprising the steps of:

providing a plastic credit card including:

a plastic substrate;

an electronic computer chip;

wherein said electronic computer chip is attached to said plastic substrate; and

a plastic top layer;

wherein said plastic top layer is laminated upon said plastic substrate thereby encasing said electronic computer chip therebetween;

a top edge;

a bottom edge; and

two side edges;

wherein said plastic credit card is formed having a flat rectangular shape having four corners;

providing a cutting tool;

using said cutting tool to cut said credit card from said top edge toward said electronic computer chip; cut said credit card from said bottom edge toward said electronic computer chip; and cut said credit card from said two side edges toward said electronic computer chip;

peeling said plastic top layer off of said plastic substrate;

detaching said electronic computer chip from said plastic substrate;

providing a metallic substrate;

attaching said electronic computer chip to said metallic substrate, thereby forming said metallic credit card.

2. The method of making the metallic credit card of claim 1 , wherein said step of attaching said electronic computer chip to said metallic substrate includes:

providing an adhesive in between said electronic computer chip and said metallic substrate.

3. The method of making the metallic credit card of claim 2 , wherein said adhesive in between said electronic computer chip and said metallic substrate.is formed as an epoxy glue.

4. The method of making the metallic credit card of claim 3 , wherein said epoxy glue is formed from an cyanoacrylate adhesive.

5. The method of making the metallic credit card of claim 1 , further comprising the step of: laser engraving said metallic substrate with personal information of a user.

6. The method of making the metallic credit card of claim 1 , further comprising the steps of: forming a depression within said metallic substrate, before said step for attaching said electronic computer chip to said metallic substrate, for said electronic computer chip to be placed therein, such that when said electronic computer chip is placed within said metallic substrate, said electronic computer chip forms a flat surface with said metallic substrate.

7. The method of making the metallic credit card of claim 1 , wherein said cutting tool is a scissor.

8. The method of making the metallic credit card of claim 1 , wherein said metallic substrate is formed having a flat rectangular shape forming four corners.

9. The method of making the metallic credit card of claim 1 , wherein said electronic computer chip is formed as an EMV chip.

10. The method of making the metallic credit card of claim 1 , wherein said metallic substrate is formed from a material chosen from a list of materials consisting of stainless steel, copper, and aluminum.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 17, 2024
From: JEAN, TRAVIS
To: TRAVIS JEAN LLC
Reel/Frame 067750/0048 →
Continuity (1)
Related Publication 20230249489A1 · Aug 10, 2023
References Cited (6)
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US 11157790B1 · Santos · 2021 [cited by examiner]
US 11562194B2 · Vu · 2023 [cited by examiner]
US 20150306897A1 · Lamb et al. · 2015 [cited by applicant]
Ex Parte Quayle Office Action dated Dec. 21, 2023 for U.S. Appl. No. 17/979,470. [cited by applicant]