IP Library › Granted Patent US 11,158,731
Granted Patent B2
US 11,158,731 · App. 16/642,886 · Granted Oct 26, 2021

Quantum well stacks for quantum dot devices

Inventors: Ravi Pillarisetty (Portland, OR); Van H. Le (Portland, OR); Nicole K. Thomas (Portland, OR); Hubert C. George (Portland, OR); Jeanette Roberts (North Plains, OR); Payam Amin (Portland, OR); Zachary R. Yoscovits (Beaverton, OR); Roman Caudillo (Portland, OR); James S. Clarke (Portland, OR); Roza Kotlyar (Portland, OR); Kanwaljit Singh (Rotterdam, NL)
Assignee: Intel Corporation
H01L29/66977G06N10/00H01L21/823475H01L27/088H01L27/1203H01L29/158H01L29/66984H01L29/7831H01L29/82H01L29/437
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Quick Facts
Patent No.
US 11,158,731
App. No.
16/642,886
Granted
Oct 26, 2021
Kind
B2
Abstract

Disclosed herein are quantum dot devices, as well as related computing devices and methods. For example, in some embodiments, a quantum dot device may include a (111) silicon substrate, a (111) germanium quantum well layer above the substrate, and a plurality of gates above the quantum well layer. In some embodiments, a quantum dot device may include a silicon substrate, an insulating material above the silicon substrate, a quantum well layer above the insulating material, and a plurality of gates above the quantum well layer.

Claims (31)

1. A quantum dot device, comprising:

a substrate, wherein the substrate includes (111) silicon;

a quantum well stack on the substrate, wherein the quantum well stack includes a quantum well layer and the quantum well layer includes (111) germanium; and

a plurality of gates above the quantum well stack, wherein the quantum well layer is between the plurality of gates and the substrate, and

wherein the quantum well stack further includes a buffer layer between the substrate and the quantum well layer and the buffer layer includes germanium tin or a group III-group V material or (111) germanium.

2. The quantum dot device of claim 1 , wherein the quantum well layer is relaxed.

3. The quantum dot device of claim 1 , wherein the quantum well layer is strained.

4. The quantum dot device of claim 1 , wherein the buffer layer further includes silicon germanium.

5. The quantum dot device of claim 4 , wherein the buffer layer further includes a second material different from silicon germanium.

6. The quantum dot device of claim 1 , wherein a germanium content of the buffer layer increases from the substrate towards the quantum well layer.

7. The quantum dot device of claim 1 , wherein the quantum well stack further includes:

a barrier layer between the buffer layer and the quantum well layer.

8. The quantum dot device of claim 7 , wherein the barrier layer is a first barrier layer, and the quantum well stack further includes:

a second barrier layer such that the quantum well layer is between the second barrier layer and the first barrier layer.

9. The quantum dot device of claim 1 , wherein at least two gates of the plurality of gates are spaced apart by spacer material.

10. A quantum dot device, comprising:

a substrate, wherein the substrate includes silicon;

a quantum well stack on the substrate, wherein the quantum well stack includes an insulating material and a quantum well layer, wherein the insulating material is between the substrate and the quantum well layer, is an oxide, has a thickness between 5 nanometers and 200 nanometers; and

a plurality of gates above the quantum well stack, wherein the quantum well layer is between the plurality of gates and the substrate.

11. The quantum dot device of claim 10 , wherein the insulating material is relaxed.

12. The quantum dot device of claim 10 , wherein the insulating material is strained.

13. The quantum dot device of claim 10 , wherein the quantum well layer includes silicon.

14. A quantum computing device, comprising:

a quantum processing device, wherein the quantum processing device includes a quantum well stack on a substrate, the quantum well stack includes a layer of an insulating material and a quantum well layer, the insulating material is between the quantum well layer and the substrate, and the quantum processing device further includes a plurality of gates above the quantum well stack to control quantum dot formation in the quantum well stack; and

a non-quantum processing device, coupled to the quantum processing device, to control voltages applied to the plurality of gates.

15. The quantum computing device of claim 14 , further comprising:

a cooling apparatus to maintain a temperature of the quantum processing device below 5 degrees Kelvin.

16. The quantum computing device of claim 14 , wherein the insulating material includes an oxide.

17. The quantum computing device of claim 14 , wherein the insulating material is relaxed.

18. The quantum computing device of claim 14 , wherein the insulating material is strained.

19. The quantum computing device of claim 14 , wherein the quantum well layer includes silicon.

Continuity (1)
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