Resin composition, prepreg, metallic foil-clad laminate, and printed wiring board
A resin composition including an inorganic filler (B) having an aluminosilicate (A) having a silicon atom content of from 9 to 23% by mass, an aluminum atom content of from 21 to 43% by mass, and an average particle diameter (D50) of from 0.5 to 10 μm; and any one or more thermosetting compounds selected from the group consisting of an epoxy resin (C), a cyanate compound (D), a maleimide compound (E), a phenolic resin (F), an acrylic resin (G), a polyamide resin (H), a polyamideimide resin (I), and a thermosetting polyimide resin (J), wherein a content of the inorganic filler (B) is from 250 to 800 parts by mass based on 100 parts by mass of resin solid content.
1. A resin composition comprising:
an inorganic filler (B) comprising an aluminosilicate (A) having a silicon atom content of from 14 to 21% by mass, an aluminum atom content of from 23 to 43% by mass, and an average particle diameter (D50) of from 0.5 to 10 μm; and
one or more thermosetting compounds selected from the group consisting of a cyanate compound (D), a maleimide compound (E), an acrylic resin (G), a polyamide resin (H), a polyamideimide resin (I), and a thermosetting polyimide resin (J),
wherein a content of the inorganic filler (B) is from 250 to 800 parts by mass based on 100 parts by mass of resin solid content.
2. The resin composition according to claim 1 , wherein the inorganic filler (B) contains a second inorganic filler (K) having an average particle: diameter (D50) of from 0.1 to 0.4 μm.
3. The resin composition according to claim 2 , wherein the second inorganic filler (K) is one or more selected from the group consisting of an aluminosilicate having a silicon atom content of from 9 to 23% by mass and an aluminum atom content of from 21 to 43% by mass, alumina, magnesium oxide, boron nitride, and aluminum nitride.
4. The resin composition according to claim 1 , wherein the cyanate compound (D) is one or more selected from the group consisting of a naphthol aralkyl-based cyanate compound represented by general formula (1), a novolac-based cyanate compound represented by general formula (2), and a biphenyl aralkyl-based cyanate compound represented by general formula (3),
wherein R1 each independently represents a hydrogen atom or a methyl group, and n1 represents an integer of from 1 to 50,
wherein R2 each independently represents a hydrogen atom or a methyl group, and n2 represents an integer of from 1 to 50 or more,
wherein R3 each independently represents a hydrogen atom or a methyl group, and n3 represents an integer of from 1 to 50.
5. The resin composition according to claim 1 , wherein the maleimide compound (E) is one or more selected from the group consisting of bis(4-maleimidophenyl)methane, 2,2-bis{4-(4-maleimidophenoxy)-phenyl}propane, and bis(3-ethyl-5-methyl-4-maleimidophenyl)methane.
6. The resin composition according to claim 1 , further comprising a molybdenum compound (L).
7. The resin composition according to claim 6 , wherein a content of the molybdenum compound (L) is from 0.1 to 10 parts by mass based on 100 parts by mass of the resin solid content.
8. The resin composition according to claim 6 , wherein a surface of the molybdenum compound (L) is treated with an inorganic oxide.
9. A prepreg comprising:
a base material; and
the resin composition according to claim 1 with which the base material is impregnated or coated.
10. A metallic foil-clad laminate comprising:
the prepreg according to claim 9 ; and
a metallic foil laminated on one or both surfaces of the prepreg.
11. A printed wiring board comprising:
an insulating layer comprising the resin composition according to claim 1 ; and
a conductor layer formed on a surface of the insulating layer.