Camera module
A camera module includes a circuit board; a photosensitive chip located on the circuit board and electrically coupled to the circuit board, a package material body arranged on the circuit board, a support member arranged on one end of the package material body away from the circuit board, and a filter having a first and a second surfaces. The package material body includes a top end bearing surface. The support member includes a support body and an extension structure, and the extension structure includes a bottom surface, the bottom surface is connected to the bearing surface, and the second surface is connected to the bottom surface. The camera module is a three-stage structure of a package material body plus a support member plus a plurality of lenses.
1. A camera module, comprising:
a circuit board;
a photosensitive chip coupled to the circuit board;
a package material body attached on the circuit board;
a support member comprising a support body mounted on a side of the package material body away from the circuit board; and
a filter having opposite first and second surfaces, wherein the filter is spaced apart from an inner wall of the support body and a distance between the filter and the inner wall of the support body ranges from about 50 μm to about 1500 μm;
wherein the package material body comprises a bearing surface away from the circuit board, the support member comprises an extension structure located on the inner wall of the support body, the extension structure comprises a bottom surface close to the package material body, and the first surface of the filter is connected to the bearing surface, and the second surface of the filter is connected to the bottom surface;
wherein the camera module further comprises a lens assembly, the lens assembly comprises a barrel and a plurality of lenses received in the barrel, and the barrel is attached with adhesive to both the support body and the extension structure along a coplanar surface formed by the support body and a top surface of the extension structure; and
wherein the package material body defines a light transmission hole in a middle portion thereof, a bottom of the light transmission hole is provided with a concave surface recessed toward an outer sidewall of the package material body, and a round chamfer is provided on a top edge of the package material body in the light transmission hole.
2. The camera module according to claim 1 , wherein the camera module further comprises a first adhesive layer and a second adhesive layer, the first adhesive layer is sandwiched between the first surface and the bearing surface, the second adhesive layer is sandwiched between the second surface and the bottom surface.
3. The camera module according to claim 1 , wherein a distance between the filter and the inner wall of the support body ranges from about 100 μm to about 500 μm.
4. The camera module of claim 1 , wherein a side of the support body away from the package material body is coplanar with a side of the extension structure away from the package material body.
5. The camera module according to claim 1 , wherein the photosensitive chip comprises a photosensitive surface away from the circuit board, the photosensitive surface comprises a photosensitive region and a non-photosensitive region surrounding the photosensitive region, and the package material body encapsulates at least a portion of the non-photosensitive region.
6. The camera module according to claim 5 , wherein an orthographic projection of the extension structure on the photosensitive surface is spaced apart from the photosensitive region, a distance between the orthographic projection of the extension structure on the photosensitive surface and the photosensitive region ranges from about 100 μm to about 500 μm.
7. The camera module according to claim 6 , wherein the distance between the orthographic projection of the extension structure on the photosensitive surface and the photosensitive region ranges from about 200 μm to about 400 μm.
8. The camera module according to claim 5 , wherein a distance between the photosensitive surface and the bottom surface ranges from about 150 μm to about 1500 μm.
9. The camera module according to claim 8 , wherein the distance between the photosensitive surface and the bottom surface ranges from about 200 μm to about 300 μm.
10. The camera module according to claim 1 , wherein a distance between an end of the extension structure away from the support body and the support body ranges from about 200 μm to about 1500 μm.
11. The camera module according to claim 10 , wherein the distance between the end of the extension structure away from the support body and the support body ranges from about 500 to about 900 μm.
12. The camera module according to claim 1 , wherein the extension structure further comprises a vertical surface away from the support body, and an inclined surface connecting the vertical surface and the bottom surface, an angle between the vertical surface and the inclined surface is greater than 90°.
13. The camera module according to claim 12 , wherein the angle between the vertical surface and the inclined surface is greater than 135°.
14. The camera module according to claim 1 , wherein the support body defines a first notch on an outer sidewall thereof adjacent to the package material body for receiving excess adhesive when attaching the support member and the package.
15. The camera module according to claim 14 , wherein the support body defines a second notch on the outer sidewall thereof away from the package material body for receiving excess adhesive when attaching a lens assembly and the support member.