Semiconductor device
A semiconductor device may include a substrate, a first transistor disposed on the substrate, and a second transistor disposed on the substrate. The first gate structure of the first transistor may include a first high-k layer, a first capping layer and a first work function layer sequentially disposed on the substrate. A material of the first work function layer includes Ta. The second transistor includes a second gate structure. The second gate structure includes a second high-k layer, a second capping layer and a second work function layer sequentially disposed on the substrate. The first capping layer and the second capping layer are formed of the same layer, and a material of the second work function layer is different from the material of the first work function layer.
1. A semiconductor device, comprising:
a substrate;
a first transistor disposed on the substrate, and comprising a first gate structure, wherein the first gate structure comprises a first high-k layer, a first capping layer, a first work function layer and an overlying work function layer sequentially disposed on the substrate, wherein a material of the first work function layer comprises Ta, and the overlying work function layer is in direct contact with the first work function layer; and
a second transistor disposed on the substrate, and comprising a second gate structure, the second gate structure comprising a second high-k layer, a second capping layer and a second work function layer sequentially disposed on the substrate, the second work function layer being in direct contact with the second capping layer, wherein the first capping layer and the second capping layer are formed of the same layer, a material of the second work function layer is different from the material of the first work function layer, and the overlying work function layer and the second work function layer are of the same layer.
2. The semiconductor device of claim 1 , wherein the material of the first work function layer comprises TaN, HfN, WN, or a combination thereof.
3. The semiconductor device of claim 1 , wherein the material of the first work function layer has a higher etching rate for a halogen based etchant than a material of the second capping layer.
4. The semiconductor device of claim 1 , wherein the material of the first capping layer and the second capping layer comprises TiSiN, TiN, TiAlN, or a combination thereof.
5. The semiconductor device of claim 1 , wherein the material of the second work function layer comprises aluminum.
6. The semiconductor device of claim 5 , wherein the material of the second work function layer comprises TiAl, TiAlC, TaAl, TaAlC, or a combination thereof.
7. The semiconductor device of claim 1 , wherein the first transistor further comprises a first glue layer disposed on the overlying work function layer.
8. The semiconductor device of claim 1 , further comprising:
a third transistor disposed on the substrate, and comprising a third gate structure, wherein the third gate structure comprises a third high-k layer, a third capping layer, and a third work function layer sequentially disposed on the substrate, a material of the third work function layer is the same as the material of the first work function layer, and a thickness of the third work function layer is different from a thickness of the first work function layer.
9. A semiconductor device, comprising:
a substrate; and
a first transistor disposed on the substrate, and comprising a first gate structure, wherein the first gate structure comprises a first high-k layer, a first capping layer, a first work function layer and an overlying work function layer sequentially disposed on the substrate the first capping layer being in direct contact with the first high-k layer, and the overlying work function layer is in direct contact with the first work function layer; and
a second transistor disposed on the substrate, and comprising a second gate structure, wherein the second gate structure comprises a second high-k layer, a second capping layer and a second work function layer sequentially disposed on the substrate, the second capping layer being in direct contact with the second high-k layer, a material of the first work function layer is different from a material of the second work function layer, the overlying work function layer and the second work function layer are of the same layer, and a material of the second high-k layer presents an etching rate for a halogen based etchant between the material of the first work function layer and a material of the second capping layer.
10. The semiconductor device of claim 9 , wherein the halogen based etchant comprises WCl 5 .
11. The semiconductor device of claim 9 , wherein a work function of the first work function layer is greater than a work function of the second work function layer.
12. The semiconductor device of claim 9 , wherein a material of the first capping layer and the material of the second capping layer comprise Ti—Si—N, TiN, TiAlN, or a combination thereof.
13. The semiconductor device of claim 9 , wherein the material of the second work function layer comprises TiAl, TiAlC, TaAl, TaAlC, or a combination thereof.
14. A semiconductor device, comprising:
a substrate;
a first gate structure disposed on the substrate and comprising a first high-k layer, a first capping layer, a first work function layer and an overlying work function layer sequentially disposed on the substrate, wherein the first work function layer is in direct contact with the first capping layer, the overlying work function layer is in direct contact with the first work function layer, and a material of the first work function layer comprises Ta; and
a second gate structure disposed on the substrate and comprising a second high-k layer, a second capping layer and a second work function layer sequentially disposed on the substrate, the second capping layer being in direct contact with the second high-k layer, wherein the second work function layer is in direct contact with the second capping layer and is formed of the same layer as the overlying work function layer.
15. The semiconductor device of claim 14 , wherein a work function of the first work function layer is greater than a work function of the second work function layer.
16. The semiconductor device of claim 14 , wherein a material of the first work function layer has a higher etching rate for a halogen based etchant than a material of the second capping layer.
17. The semiconductor device of claim 16 , wherein the halogen based etchant comprises Cl-based etchant or F-based etchant.
18. The semiconductor device of claim 16 , wherein the halogen based etchant comprises WCl 5 .
19. The semiconductor device of claim 14 , wherein the material of the first capping layer and the second capping layer comprises Ti—Si—N, TiN, TiAlN, or a combination thereof.
20. The semiconductor device of claim 14 , wherein a material of the second work function layer comprises TiAl, TiAlC, TaAl, TaAlC, or a combination thereof.