Deposition of metal films with tungsten liner
Apparatuses and methods to provide electronic devices having metal films are provided. Some embodiments of the disclosure utilize a metallic tungsten layer as a liner that is filled with a metal film comprising cobalt. The metallic tungsten layer has good adhesion to the cobalt leading to enhanced cobalt gap-fill performance.
1. A method for depositing a metal film, the method comprising:
forming at least one feature on a top surface of a substrate;
exposing the substrate to a plasma formed from a first gas to form a non-nitride based metallic tungsten layer on the top surface and on the at least on feature, the first gas comprising a metallic tungsten precursor gas selected from the group consisting of a fluorine free tungsten oxy-halide precursor, a chlorine free tungsten halide precursor, and a fluorine-free, chlorine-free tungsten precursor;
forming a cobalt film on a top surface of the non-nitride based metallic tungsten layer; and
annealing the substrate.
2. The method of claim 1 , further comprising forming a dielectric layer on the top surface of the substrate prior to forming the non-nitride based metallic tungsten layer.
3. The method of claim 1 , wherein the first gas comprises a fluorine-free, chlorine-free tungsten precursor.
4. The method of claim 1 , wherein the first gas further comprises a reactant gas.
5. The method of claim 4 , wherein the reactant gas is selected from the group consisting of hydrogen (H 2 ), ammonia (NH 3 ), and hydrazine (N 2 H 4 ).
6. The method of claim 1 , wherein the first gas further comprises a carrier gas selected from the group consisting of argon (Ar), helium (He), nitrogen (N 2 ).
7. The method of claim 1 , wherein the cobalt film comprises CVD cobalt.
8. The method of claim 1 , wherein the at least one feature is selected from a trench, a via, or a peak.
9. The method of claim 1 , wherein the annealing occurs in an atmosphere of H 2 (gas).