Semiconductor device having contact plug connected to gate structure on PMOS region
A semiconductor device includes a substrate having a NMOS region and a PMOS region; a gate structure extending along a first direction from the NMOS region to the PMOS region on the substrate; and a first contact plug landing directly on the gate structure closer to the PMOS region from a boundary separating the NMOS region and the PMOS region. Preferably, the semiconductor device further includes a first source/drain region extending along a second direction adjacent to two sides of the gate structure on the NMOS region and a second source/drain region extending along the second direction adjacent to two sides of the gate structure on the PMOS region.
1. A semiconductor device, comprising:
a substrate having a NMOS region and a PMOS region separated by a boundary;
a metal gate on the substrate and extending continuously along a first direction from the NMOS region to the PMOS region, wherein the metal gate comprises a p-type work function metal layer on the PMOS region and a n-type work function metal layer extending from the NMOS region to the PMOS region and covering the p-type work function metal layer;
a first source/drain region adjacent to two sides of the metal gate on the NMOS region;
a second source/drain region adjacent to two sides of the metal gate on the PMOS region; and
a first contact plug landing directly on a portion of the metal gate on the PMOS region and near the second source/drain region and vertically above an overlapping region of the n-type work function metal layer and the p-type work function metal layer.
2. The semiconductor device of claim 1 , wherein the first contact plug is disposed immediately adjacent to the boundary without overlapping the boundary.
3. The semiconductor device of claim 1 , further comprising the first source/drain region extending along a second direction adjacent to two sides of the metal gate on the NMOS region.
4. The semiconductor device of claim 3 , further comprising a second contact plug landing on the first source/drain region.
5. The semiconductor device of claim 1 , further comprising the second source/drain region extending along a second direction adjacent to two sides of the metal gate on the PMOS region.
6. The semiconductor device of claim 5 , further comprising a third contact plug landing on the second source/drain region.
7. The semiconductor device of claim 5 , wherein the first contact plug is disposed on the metal gate directly on top of a channel region between the second source/drain region.
8. The semiconductor device of claim 5 , wherein the first contact plug is disposed on the metal gate adjacent to one side of the second source/drain region and away from the boundary.
9. The semiconductor device of claim 5 , wherein the first contact plug is disposed on the metal gate adjacent to one side of the second source/drain region and closer to the boundary.
10. A semiconductor device, comprising:
a substrate having a NMOS region and a PMOS region;
a metal gate extending continuously along a first direction from the NMOS region to the PMOS region on the substrate;
a first source/drain region extending along a second direction adjacent to two sides of the metal gate on the NMOS region;
a second source/drain region extending along the second direction adjacent to two sides of the metal gate on the PMOS region;
a first contact plug landing on the second source/drain region adjacent to one side of the metal gate;
a second contact plug landing on the second source/drain region adjacent to another side of the metal gate; and
a third contact plug landing directly on a portion of the metal gate on the PMOS region and not between the first source/drain region and the second source/drain region.