IP Library › Granted Patent US 11,172,837
Granted Patent B2
US 11,172,837 · App. 16/164,264 · Granted Nov 16, 2021

Forming wearable stacked strain gauge sensor for monitoring

Inventors: Katsuyuki Sakuma (Fishkill, NY); Jeffrey D. Gelorme (Burlington, CT); Marlon Agno (Scarsdale, NY)
Assignee: International Business Machines Corporation
A61B5/02444A61B5/02241A61B5/6826G01L1/2287A61B5/4082A61B2562/0247
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Quick Facts
Patent No.
US 11,172,837
App. No.
16/164,264
Granted
Nov 16, 2021
Kind
B2
Abstract

In one aspect, forming a stacked strain gauge sensor with increased electrical resistance includes: forming multiple sensor layers, wherein the sensor layers include strain gauge sensor wires on substrates; forming holes in the substrates; stacking the sensor layers, one on top of another, to form a stack with the holes aligned in one or more locations forming through holes in the stack; and forming interconnects in the holes in one or more other locations interconnecting the strain gauges sensor wires between adjacent sensor layers to form a stacked strain gauge sensor. A stacked strain gauge sensor and method of use thereof are also provided.

Claims (20)

1. A method, comprising:

forming multiple sensor layers by depositing strain gauge sensor wires on substrates;

forming holes in the substrates;

stacking the formed multiple sensor layers, one on top of another, to form a stack with the formed holes aligned in one or more locations forming through holes in the stack; and

forming interconnects in the holes in one or more other locations interconnecting the strain gauge sensor wires between adjacent sensor layers to form a stacked strain gauge sensor.

2. The method of claim 1 , wherein the strain gauge sensor wires have a serpentine configuration.

3. The method of claim 1 , wherein the strain gauge sensor wires comprise a material selected from the group consisting of: an electrically conductive paste, a metal, a metal alloy, a doped semiconductor material, and combinations thereof.

4. The method of claim 1 , wherein the depositing further comprises:

printing the strain gauge sensor wires on the substrates.

5. The method of claim 1 , wherein each of the substrates comprises:

a cover film; and

a backing film attached to the cover film by an adhesive layer.

6. The method of claim 5 , wherein the cover film comprises a release film coated with a release agent.

7. The method of claim 5 , wherein the backing film comprises a material selected from the group consisting of: polyurethane, polyester, polyimide, and combinations thereof.

8. The method of claim 5 , wherein the adhesive layer comprises an adhesive selected from the group consisting of: an acrylate adhesive, an acrylic adhesive, and combinations thereof.

9. The method of claim 8 , wherein the adhesive layer comprises cyanoacrylate glue.

10. The method of claim 1 , wherein the stacked strain gauge sensor has a footprint with dimensions of less than or equal to 15 mm×15 mm.

11. The method of claim 1 , wherein the stacked strain gauge sensor is configured to fit on a body surface.

12. The method of claim 11 , wherein the stacked strain gauge sensor is attachable to the body surface with an adhesive.

13. The method of claim 11 , wherein the body surface comprises a fingernail.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 18, 2018
From: SAKUMA, KATSUYUKI; GELORME, JEFFREY D.; AGNO, MARLON
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 047690/0280 →
Continuity (1)
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