Semiconductor device and method of manufacturing the same
A semiconductor device includes a lower electrode on a substrate, a capacitor dielectric layer on the lower electrode, and an upper electrode on the capacitor dielectric layer. The capacitor dielectric layer includes a base layer on the lower electrode and a dielectric particle layer in at least a portion of the base layer. The base layer includes a first dielectric material, and the dielectric particle layer extends at least partially continuously along a thickness direction of the capacitor dielectric layer and includes a second dielectric material different from the first dielectric material.
1. A semiconductor device comprising:
a substrate;
a gate structure in or on the substrate, the gate structure extending in a first direction;
a bit line structure on the gate structure, the bit line structure extending in a second direction different from the first direction; and
a capacitor structure on the bit line structure, the capacitor structure comprising:
a lower electrode;
a capacitor dielectric layer; and
an upper electrode,
wherein the capacitor dielectric layer comprises:
a first portion comprising zirconium, aluminium and oxygen; and
a second portion comprising zirconium, aluminum and oxygen,
wherein a first content of the aluminum in the first portion of the capacitor dielectric layer is higher than a second content of the aluminum in the second portion of the capacitor dielectric layer;
wherein the second portion of the capacitor dielectric layer is closer to a top surface of the lower electrode than the first portion of the capacitor dielectric layer.
2. The semiconductor device of claim 1 , wherein a third portion of the capacitor dielectric layer is substantially free of aluminum, and the third portion of the capacitor dielectric layer is closer to the top surface of the lower electrode than the second portion of the capacitor dielectric layer.
3. The semiconductor device of claim 1 , further comprising a dielectric capping layer conformally disposed between the capacitor dielectric layer and the upper electrode.
4. The semiconductor device of claim 1 , wherein the capacitor dielectric layer comprises:
a base layer comprising a first dielectric material; and
a plurality of dielectric nanoparticles dispersed in the base layer, the dielectric nanoparticles comprising a second dielectric material which is different from the first dielectric material.
5. The semiconductor device of claim 4 , wherein a first density of the dielectric nanoparticles dispersed in the first portion of the capacitor dielectric layer is higher than a second density of the dielectric nanoparticles dispersed in the second portion of the capacitor dielectric layer.
6. The semiconductor device of claim 4 , wherein a third portion of the capacitor dielectric layer is substantially free of the dielectric nanoparticles, and the third portion of the capacitor dielectric layer is closer to the top surface of the lower electrode than the second portion of the capacitor dielectric layer.
7. The semiconductor device of claim 4 , wherein each of the dielectric nanoparticles has a diameter of about 1 Angstrom (Å) to about 10 Å.
8. The semiconductor device of claim 1 , wherein a thickness of the capacitor dielectric layer is about 20 Angstroms (Å) to about 80 Å.
9. The semiconductor device of claim 1 , wherein the capacitor structure further comprises:
a first interface layer between the lower electrode and the capacitor dielectric layer; and
a second interface layer between the capacitor dielectric layer and the upper electrode.
10. The semiconductor device of claim 1 , wherein the lower electrode has a cylindrical shape extending in a third direction perpendicular to a surface of the substrate, and
the capacitor dielectric layer is disposed conformally on the top surface and a sidewall of the lower electrode.
11. The semiconductor device of claim 1 , wherein the lower electrode has a pillar shape extending in a third direction perpendicular to a surface of the substrate, and
the capacitor dielectric layer is disposed conformally on the top surface and a sidewall of the lower electrode.
12. A semiconductor device comprising:
a substrate;
a gate structure in or on the substrate, the gate structure extending in a first direction;
a bit line structure on the gate structure, the bit line structure extending in a second direction different from the first direction; and
a capacitor structure on the bit line structure, the capacitor structure including:
a lower electrode;
a capacitor dielectric layer; and
an upper electrode,
wherein the capacitor dielectric layer comprises:
a first portion, comprising zirconium, aluminium and oxygen;
a second portion that is closer to a top surface of the lower electrode than the first portion, the second portion comprising zirconium, aluminium and oxygen; and
a third portion that is closer to the top surface of the lower electrode than the second portion, the third portion being substantially free of aluminum.
13. The semiconductor device of claim 12 , further comprising a dielectric capping layer conformally disposed between the capacitor dielectric layer and the upper electrode.
14. The semiconductor device of claim 12 , wherein the capacitor dielectric layer includes:
a base layer comprising a first dielectric material; and
a plurality of dielectric nanoparticles dispersed in the base layer, the dielectric nanoparticles comprising a second dielectric material which is different from the first dielectric material.
15. The semiconductor device of claim 14 , wherein a first density of the dielectric nanoparticles dispersed in the first portion of the capacitor dielectric layer is higher than a second density of the dielectric nanoparticles dispersed in the second portion of the capacitor dielectric layer.
16. The semiconductor device of claim 14 , wherein the third portion of the capacitor dielectric layer is substantially free of the dielectric nanoparticles.
17. The semiconductor device of claim 14 , wherein each of the dielectric nanoparticles has a diameter of about 1 Angstrom (Å) to about 10 Å, and
a thickness of the capacitor dielectric layer is about 20 Å to 80 Å.
18. The semiconductor device of claim 12 , wherein the capacitor structure further comprises:
a first interface layer between the lower electrode and the capacitor dielectric layer; and
a second interface layer between the capacitor dielectric layer and the upper electrode.
19. The semiconductor device of claim 12 , wherein the lower electrode has a cylindrical shape extending in a third direction perpendicular to a surface of the substrate, and
the capacitor dielectric layer is disposed conformally on the top surface and a sidewall of the lower electrode.
20. The semiconductor device of claim 12 , wherein the lower electrode has a pillar shape extending in a third direction perpendicular to a surface of the substrate, and
the capacitor dielectric layer is disposed conformally on the top surface and a sidewall of the lower electrode.