Array substrate and fabricating method thereof, and display device
A fabricating method of an array substrate includes: forming a first semiconductor pattern and a first insulating layer on a substrate; forming a first gate pattern and a second gate pattern isolated from each other; forming a second insulating layer; forming a second semiconductor pattern; forming a first metal pattern and a second metal pattern and a third metal pattern respectively lap-jointed with the second semiconductor pattern; forming a third insulating layer; and forming a first via hole, a second via hole, first source and drain electrodes, and second source and drain electrodes, where the first source and drain electrode are respectively connected to the first semiconductor pattern through the first via hole, and the second source and drain electrodes are respectively connected to the second semiconductor pattern through the second via hole.
1. A fabricating method of an array substrate, wherein the array substrate comprises a first region and a second region, and the method comprising:
forming a first semiconductor pattern in the first region;
forming a first insulating layer at least covering the first semiconductor pattern;
forming a first gate pattern and a second gate pattern isolated from each other in the first region and the second region, respectively;
forming a second insulating layer at least covering the first gate pattern;
forming a second semiconductor pattern in the second region;
forming a first metal pattern in the first region and forming a second metal pattern and a third metal pattern respectively lap-jointed with the second semiconductor pattern in the second region by one film forming process;
forming a third insulating layer at least covering the second semiconductor pattern, the first metal pattern, the second metal pattern and the third metal pattern;
forming a first via hole penetrating through the first insulating layer, the second insulating layer, and the third insulating layer in the first region, and forming a second via hole penetrating through the third insulating layer in the second region; and
forming a first source electrode and a first drain electrode, a second source electrode and a second drain electrode, wherein the first source electrode and the first drain electrode are respectively connected to the first semiconductor pattern through the first via hole, and the second source electrode and the second drain electrode are respectively connected to the second semiconductor pattern through the second via hole;
forming a first gate insulating layer on the second semiconductor pattern, wherein the second gate pattern is on the first gate insulating layer, and wherein the third insulating layer covers the second semiconductor pattern, the first metal pattern, the second metal pattern and the third metal pattern, and the first gate insulating layer and the second gate pattern,
wherein the first semiconductor pattern, the first via hole, the first source electrode and the first drain electrode connected to the first semiconductor pattern through the first via hole, and the first gate pattern and the first metal pattern formed over the first semiconductor pattern constitute a low temperature polysilicon thin film transistor; and
wherein the first metal pattern is made of a same material as the second metal pattern, the third metal pattern and the second gate pattern.
2. The fabricating method of the array substrate according to claim 1 , wherein the first semiconductor pattern is made of polysilicon, and wherein the second semiconductor pattern is made of one of or combination of more of indium zinc oxide, indium tin zinc oxide, indium gallium oxide, indium gallium zinc oxide, indium tungsten oxide, zinc oxide, tin oxide, gallium zinc oxide and zinc tin oxide.
3. The fabricating method of the array substrate according to claim 1 , wherein the second source electrode is connected to the second metal pattern through the second via hole, and the second drain electrode is connected to the third metal pattern through the second via hole.
4. The fabricating method of the array substrate according to claim 3 , wherein a process of forming the first via hole and the second via hole comprises:
forming the first via hole and the second via hole in a same exposure process; and
cleaning the first via hole and the second via hole by hydrofluoric acid.
5. An array substrate, comprising:
a substrate comprising a first region and a second region;
a first semiconductor pattern located in the first region;
a first insulating layer at least covering the first semiconductor pattern;
a first gate pattern and a second gate pattern isolated from each other and disposed in the first region and the second region, respectively;
a second insulating layer at least covering the first gate pattern;
a first metal pattern located on the second insulating layer of the first region;
a second semiconductor pattern located on the second insulating layer of the second region;
a second metal pattern and a third metal pattern, which are located in the second region and respectively lap-jointed with the second semiconductor pattern;
a third insulating layer at least covering the second semiconductor pattern, the first metal pattern, the second metal pattern and the third metal pattern;
a first via hole located in the first region and penetrating the first insulating layer, the second insulating layer and the third insulating layer;
a second via hole located in the second region and penetrating through the third insulating layer;
a first source electrode and a first drain electrode; and
a second source electrode and a second drain electrode,
wherein the first source electrode and the first drain electrode are respectively connected to the first semiconductor pattern through the first via hole, and the second source electrode and the second drain electrode are respectively connected to the second semiconductor pattern through the second via hole;
a first gate insulating layer located on the second semiconductor pattern, wherein the second gate pattern is located on the first gate insulating layer, and wherein the third insulating layer covers the second semiconductor pattern, the first metal pattern, the second metal pattern and the third metal pattern, and the first gate insulating layer and the second gate pattern,
wherein the first semiconductor pattern, the first via hole, the first source electrode and the first drain electrode connected to the first semiconductor pattern through the first via hole, and the first gate pattern and the first metal pattern formed over the first semiconductor pattern constitute a low temperature polysilicon thin film transistor; and
wherein the first metal pattern is made of a same material as the second metal pattern, the third metal pattern and the second gate pattern.
6. The array substrate according to claim 5 , wherein the first semiconductor pattern is made of polysilicon, and wherein the second semiconductor pattern is made of one of or combination of more of indium tin zinc oxide, indium gallium oxide, indium gallium zinc oxide, indium tungsten oxide, zinc oxide, tin oxide, gallium zinc oxide, and zinc tin oxide.
7. The array substrate according to claim 5 , wherein the second source electrode is connected to the second metal pattern through the second via hole, and the second drain electrode is connected to the third metal pattern through the second via hole.
8. The array substrate according to claim 5 , wherein an orthographic projection of the second metal pattern and the third metal pattern on the substrate covers an orthographic projection of the second via hole on the substrate.
9. The array substrate according to claim 5 , wherein the second metal pattern and the third metal pattern are disposed in a same layer as the second gate pattern.
10. The array substrate according to claim 5 , wherein a width of the first gate insulating layer is greater than a width of the second gate pattern.
11. The array substrate according to claim 5 , wherein the first metal pattern is disposed in a same layer as the second metal pattern, the third metal pattern and the second gate pattern.
12. The array substrate according to claim 5 , wherein the second semiconductor pattern is made of one of or combination of more of indium tin zinc oxide, indium gallium oxide, indium gallium zinc oxide, indium tungsten oxide, zinc oxide, tin oxide, gallium zinc oxide and zinc tin oxide.
13. A display device comprising an array substrate, the array substrate comprising:
a substrate comprising a first region and a second region;
a first semiconductor pattern located in the first region;
a first insulating layer at least covering the first semiconductor pattern;
a first gate pattern and a second gate pattern isolated from each other and disposed in the first region and the second region, respectively;
a second insulating layer at least covering the first gate pattern;
a first metal pattern located on the second insulating layer of the first region;
a second semiconductor pattern located on the second insulating layer of the second region;
a second metal pattern and a third metal pattern, which are located in the second region and respectively lap-jointed with the second semiconductor pattern;
a third insulating layer at least covering the second semiconductor pattern, the first metal pattern, the second metal pattern and the third metal pattern;
a first via hole located in the first region and penetrating the first insulating layer, the second insulating layer and the third insulating layer;
a second via hole located in the second region and penetrating through the third insulating layer;
a first source electrode and a first drain electrode; and
a second source electrode and a second drain electrode,
wherein the first source electrode and the first drain electrode are respectively connected to the first semiconductor pattern through the first via hole, and the second source electrode and the second drain electrode are respectively connected to the second semiconductor pattern through the second via hole;
a first gate insulating layer located on the second semiconductor pattern, wherein the second gate pattern is located on the first gate insulating layer, and wherein the third insulating layer covers the second semiconductor pattern, the first metal pattern, the second metal pattern and the third metal pattern, and the first gate insulating layer and the second gate pattern,
wherein the first semiconductor pattern, the first via hole, the first source electrode and the first drain electrode connected to the first semiconductor pattern through the first via hole, and the first gate pattern and the first metal pattern formed over the first semiconductor pattern constitute a low temperature polysilicon thin film transistor; and
wherein the first metal pattern is made of a same material as the second metal pattern, the third metal pattern and the second gate pattern.