Memory device and manufacturing method thereof
A magnetoresistive memory device includes a memory stack, a spin-orbit-torque (SOT) layer, and a free layer. The memory stack includes a pinned layer and a reference layer over the pinned layer. The SOT layer is spaced apart from the memory stack. The free layer is over the memory stack and the SOT layer.
1. A magnetoresistive memory device comprising:
a memory stack comprising:
a pinned layer; and
a reference layer over the pinned layer;
a spin-orbit-torque (SOT) layer spaced apart from the memory stack; and
a free layer over the memory stack and the SOT layer.
2. The magnetoresistive memory device of claim 1 , further comprising a capping layer over the free layer.
3. The magnetoresistive memory device of claim 2 , wherein perpendicular magnetic anisotropy is formed at an interface of the free layer and the capping layer.
4. The magnetoresistive memory device of claim 2 , wherein the capping layer overlaps the SOT layer.
5. The magnetoresistive memory device of claim 1 , wherein the free layer and the SOT layer extend toward different directions.
6. The magnetoresistive memory device of claim 1 , wherein the memory stack further comprises a first electrode, and the pinned layer and the reference layer are over the first electrode.
7. The magnetoresistive memory device of claim 6 , wherein the memory stack further comprises a seed layer between the first electrode and the pinned layer.
8. The magnetoresistive memory device of claim 1 , further comprising:
a second electrode over the SOT layer;
a first top via over the second electrode;
a bit line over the SOT layer and connected to the second electrode through the first top via; and
a third electrode over the SOT layer.
9. The magnetoresistive memory device of claim 8 , wherein the second electrode and the third electrode are on opposite sides of the free layer.
10. The magnetoresistive memory device of claim 1 , wherein the memory stack further comprises a tunnel barrier layer between the reference layer and the free layer.
11. A magnetoresistive memory device, comprising:
a memory stack comprising:
a reference layer; and
a tunnel barrier layer over the reference layer;
a spin-orbit-torque (SOT) layer;
a free layer, wherein a bottom surface of the free layer is in contact with both a top surface of the tunnel barrier layer and a top surface of the SOT layer; and
a capping layer over the free layer, wherein the free layer is between the tunnel barrier layer and the capping layer.
12. The magnetoresistive memory device of claim 11 , wherein the memory stack further comprises a pinned layer, and the reference layer is between the pinned layer and the tunnel barrier layer.
13. The magnetoresistive memory device of claim 11 , wherein the tunnel barrier layer and the capping layer are made of the same material.
14. The magnetoresistive memory device of claim 11 , further comprising a second electrode and a third electrode in contact with the SOT layer and on opposite sides of the capping layer.
15. The magnetoresistive memory device of claim 14 , further comprising:
a first top via and a second top via respectively over the second electrode and the third electrode; and
a bit line connected to the first top via.
16. A method for manufacturing a magnetoresistive memory device comprising:
forming a memory stack;
forming a dielectric layer covering the memory stack;
forming a spin-orbit-torque (SOT) layer in the dielectric layer and spaced apart from the memory stack;
removing a portion of the dielectric layer to expose the memory stack; and
forming a free layer over the memory stack and the SOT layer.
17. The method of claim 16 , further comprising forming a capping layer over the free layer.
18. The method of claim 16 , wherein forming the memory stack comprises:
forming a conductive layer;
forming a seed layer over the conductive layer;
forming a pinned layer over the seed layer;
forming a spacer layer over the pinned layer;
forming a reference layer over the spacer layer;
forming a tunnel barrier layer over the reference layer; and
patterning the tunnel barrier layer, the reference layer, the spacer layer, the pinned layer, the seed layer, and the conductive layer to form the memory stack.
19. The method of claim 16 , further comprising forming a first electrode and a second electrode over the SOT layer and on opposite sides of the free layer.
20. The method of claim 19 , further comprising:
forming a first top via and a second top via respectively over the first electrode and the second electrode; and
forming a bit line over the first electrode and connected to the first top via.