Radio-frequency module

1. A radio-frequency module comprising:

a multilayer substrate including a plurality of layers stacked on each other between a first main surface and a second main surface opposed to the first main surface; and

a circuit component mounted on the multilayer substrate, the circuit component including a first switch and a plurality of bumps connected to the first main surface of the multilayer substrate; wherein

the plurality of bumps include:

a first bump defining a common terminal of the first switch; and

a second bump defining a first selection terminal of the first switch, the first selection terminal and the common terminal being connectable with each other through the first switch;

the multilayer substrate further includes:

a ground via passing through at least one of the plurality of layers; and

a ground pattern disposed inside the multilayer substrate without being exposed to the first main surface and the second main surface, and extending in a direction parallel or substantially parallel with the first main surface; and

at least a portion of the ground pattern is disposed between the first bump and the second bump in a plan view of the multilayer substrate.

2. The radio-frequency module according to claim 1 , wherein

the ground via is disposed between the first bump and the second bump in the plan view of the multilayer substrate.

3. The radio-frequency module according to claim 1 , wherein

the plurality of bumps include a third bump defining a second selection terminal of the first switch, the second selection terminal and the common terminal of the first switch connectable with each other through the first switch; and

at least the portion of the ground pattern is disposed between the first bump and the third bump in the plan view of the multilayer substrate.

4. The radio-frequency module according to claim 3 , wherein

the circuit component switches between a first connection of the common terminal to the first selection terminal and a second connection of the common terminal to the second selection terminal.

5. The radio-frequency module according to claim 4 , wherein

the ground via is disposed between the first bump and the second bump in the plan view of the multilayer substrate.

6. The radio-frequency module according to claim 3 , wherein

the ground via is disposed between the first bump and the second bump in the plan view of the multilayer substrate.

7. The radio-frequency module according to claim 6 , wherein

the circuit component is a packaged circuit component having a rectangular or substantially rectangular parallelepiped shape.

8. The radio-frequency module according to claim 7 , wherein

the first bump and the second bump are disposed on an outer surface of the circuit component that opposes the first main surface.

9. The radio-frequency module according to claim 8 , wherein

a distance between the first bump and the second bump is about 50 μm to about 150 μm.

10. The radio-frequency module according to claim 9 , wherein

the first bump and the second bump are solder bumps.

11. The radio-frequency module according to claim 10 , wherein

the plurality of layers include dielectric layers each having a thickness of about 10 μm to about 20 μm.

12. The radio-frequency module according to claim 11 , wherein

the ground via and the ground pattern include a metal or an alloy including copper.

13. The radio-frequency module according to claim 12 , wherein

the ground via has a cylindrical or substantially cylindrical shape and includes a diameter of about 100 μm.

14. The radio-frequency module according to claim 13 , wherein

the multilayer substrate includes a second ground via passing through at least one of the plurality of layers; and

a distance between the ground via and the second ground via is about ¼ or smaller of a wavelength of radio-frequency waves used in the radio-frequency module.

15. The radio-frequency module according to claim 3 , further comprising:

a directional coupler connected to the first switch.

16. The radio-frequency module according to claim 15 , wherein

the directional coupler is disposed on the first main surface.

17. The radio-frequency module according to claim 16 , further comprising:

a second switch connected to the directional coupler.

18. The radio-frequency module according to claim 17 , wherein

the directional coupler includes a first input/output port, a second input/output port, a first coupled port, and a second coupled port; and

the directional coupler outputs a portion of a radio-frequency signal propagating between the first input/output port and the second input/output port to the first coupled port and the second coupled port.

19. The radio-frequency module according to claim 16 , wherein

the directional coupler includes a first input/output port, a second input/output port, a first coupled port, and a second coupled port; and

the directional coupler outputs a portion of a radio-frequency signal propagating between the first input/output port and the second input/output port to the first coupled port and the second coupled port.

20. The radio-frequency module according to claim 1 , further comprising:

a directional coupler connected to the first switch.

21. The radio-frequency module according to claim 20 , wherein

the directional coupler is disposed on the first main surface.

22. The radio-frequency module according to claim 21 , further comprising:

a second switch connected to the directional coupler.

23. The radio-frequency module according to claim 22 , wherein

the directional coupler includes a first input/output port, a second input/output port, a first coupled port, and a second coupled port; and

the directional coupler outputs a portion of a radio-frequency signal propagating between the first input/output port and the second input/output port to the first coupled port and the second coupled port.

24. The radio-frequency module according to claim 1 , wherein

a distance between the first bump and the second bump is about 50 μm to about 150 μm.