Apparatus for increasing heat dissipation capacity of a DIN rail mounted enclosure
A mounting enclosure assembly is configured to mount electronic components onto a DIN rail. The mounting enclosure assembly includes a mounting bracket including a body having at least one elongate slot configured to receive an edge of the electronic component therein. The mounting enclosure assembly further includes a heat sink secured to the mounting bracket. The heat sink includes a mounting configuration configured to secure the heat sink and the mounting bracket to the DIN rail. The mounting enclosure assembly further includes a thermal bonding material disposed within the slot to secure the electronic component to the body of the mounting bracket within the slot. Other embodiments of the mounting enclosure assembly are further disclosed.
1. A mounting enclosure assembly configured to mount electronic components onto a DIN rail, the mounting enclosure assembly comprising:
a mounting bracket including a body having at least one elongated slot configured to receive an edge of a printed circuit board assembly therein, and a raised portion having a display panel, which displays information about the printed circuit board assembly, the printed circuit board assembly housed within the mounting enclosure assembly;
a heat sink secured to the mounting bracket, the heat sink including a mounting configuration configured to secure the heat sink and the mounting bracket to the DIN rail; and
a thermal bonding material disposed within the at least one elongated slot to secure the printed circuit board assembly to the body of the mounting bracket within the at least one elongated slot,
wherein a back wall of the body of the mounting bracket includes a locking mechanism comprising a head portion and a handle portion that is connected to the head portion, and wherein the locking mechanism is used for releasably locking the mounting enclosure assembly to the DIN rail by pushing the handle portion so that the head portion overlaps a flange of the DIN rail and slides into a recessed slot of the back wall of the mounting bracket.
2. The mounting enclosure assembly of claim 1 , wherein the thermal bonding material includes a flexible sheet that is wrapped along the edge of the printed circuit board assembly.
3. The mounting enclosure assembly of claim 2 , wherein the flexible sheet embodies a thermal foam pad.
4. The mounting enclosure assembly of claim 1 , wherein the thermal bonding material includes a thermal compound paste that is disposed within the at least one elongated slot prior to inserting the edge of the printed circuit board assembly into the at least one elongated slot.
5. The mounting enclosure assembly of claim 1 , wherein the mounting configuration includes a slot having snap-fit protrusions that are sized to receive, in snap-fit relation, the DIN rail within the slot having the snap-fit protrusions.
6. The mounting enclosure assembly of claim 5 , wherein the heat sink includes fins that extend toward the DIN rail.
7. The mounting enclosure assembly of claim 1 , wherein the mounting bracket is fabricated from plastic material.
8. The mounting enclosure assembly of claim 7 , wherein the heat sink is fabricated from aluminum material.
9. A mounting enclosure assembly configured to mount electronic components onto a DIN rail, the mounting enclosure assembly comprising:
a mounting bracket including a heat sink configured to secure the mounting bracket to the DIN rail, a retainer secured to the heat sink and configured to receive an edge of a printed circuit board assembly therein, a body, and a raised portion having a display panel, which displays information about the printed circuit board assembly, the printed circuit board assembly housed within the mounting enclosure assembly; and
a thermal bonding material disposed within the retainer to secure the printed circuit board assembly to the heat sink of the mounting bracket within the retainer,
wherein a back wall of the body of the mounting bracket includes a locking mechanism comprising a head portion and a handle portion that is connected to the head portion, and wherein the locking mechanism is used for releasably locking the mounting enclosure assembly to the DIN rail by pushing the handle portion so that the head portion overlaps a flange of the DIN rail and slides into a recessed slot of the back wall of the mounting bracket.
10. The mounting enclosure assembly of claim 9 , wherein the thermal bonding material includes a flexible sheet that is wrapped along the edge of the printed circuit board assembly.
11. The mounting enclosure assembly of claim 10 , wherein the flexible sheet embodies a thermal foam pad.
12. The mounting enclosure assembly of claim 9 , wherein the thermal bonding material includes a thermal compound paste that is disposed within the retainer prior to inserting the edge of the printed circuit board assembly into the retainer.
13. The mounting enclosure assembly of claim 9 , wherein the mounting bracket is fabricated from plastic material.
14. A mounting enclosure assembly configured to mount electronic components onto a DIN rail, the mounting enclosure assembly comprising:
a mounting bracket including a body having a slot configured to receive an edge of a printed circuit board assembly therein, the printed circuit board assembly housed within the mounting enclosure assembly;
a heat sink secured to the mounting bracket, the heat sink including a mounting configuration configured to secure the heat sink and the mounting bracket to the DIN rail; and
a thermal bonding material disposed within the slot to secure the printed circuit board assembly to the body of the mounting bracket within the slot,
wherein a back wall of the body of the mounting bracket includes a locking mechanism comprising a head portion and a handle portion that is connected to the head portion, and wherein the locking mechanism is used for releasably locking the mounting enclosure assembly to the DIN rail by pushing the handle portion so that the head portion overlaps a flange of the DIN rail and slides into a recessed slot of the back wall of the mounting bracket.
15. The mounting enclosure assembly of claim 14 , wherein the thermal bonding material includes a flexible sheet that is wrapped along the edge of the printed circuit board assembly.
16. The mounting enclosure assembly of claim 15 , wherein the flexible sheet embodies a thermal foam pad.
17. The mounting enclosure assembly of claim 14 , wherein the thermal bonding material includes a thermal compound paste that is disposed within the at least one elongated slot prior to inserting the edge of the printed circuit board assembly into the at least one elongated slot.
18. The mounting enclosure assembly of claim 14 , wherein the mounting configuration includes a slot having snap-fit protrusions that are sized to receive, in snap-fit relation, the DIN rail within the slot having the snap-fit protrusions.
19. The mounting enclosure assembly of claim 18 , wherein the heat sink includes fins that extend toward the DIN rail.
20. The mounting enclosure assembly of claim 14 , wherein the mounting bracket is fabricated from plastic material.
21. The mounting enclosure assembly of claim 20 , wherein the heat sink is fabricated from aluminum material. .